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Low-temperature-resistant waterborne epoxy resin and synthesis and preparation method thereof

A water-based epoxy resin, epoxy resin technology, applied in epoxy resin coatings, coatings and other directions, can solve problems such as unsatisfactory application

Pending Publication Date: 2022-02-25
雅安市弘利展化工有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0010] Although the technology of water-based epoxy emulsion has made great progress, its application in some fields is still not ideal

Method used

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  • Low-temperature-resistant waterborne epoxy resin and synthesis and preparation method thereof
  • Low-temperature-resistant waterborne epoxy resin and synthesis and preparation method thereof

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preparation example Construction

[0041] The present invention also proposes a synthesis and preparation method of low-temperature resistant water-based epoxy resin, the synthesis and preparation method comprising:

[0042] S1. Accurately weigh the epoxy resin and add it to the reaction vessel, and raise the temperature to 50-60°C;

[0043] S2. Melt the solid compound epoxy resin emulsifier by heating, add it into the reaction vessel and mix it with epoxy resin, and heat it at 50-60°C, using a high-speed disperser at a speed of 2000-8000r / min. High-speed dispersion;

[0044] S3. After dispersion, cool naturally to 35°C and discharge.

[0045] In some embodiments, the synthetic preparation method also includes adding water before step S3:

[0046] S21. After dispersing for 30-60 minutes and until the temperature of the material reaches 65°C, gradually add metered water. During the process of adding water, it is slow first and then fast before and after the phase transition point;

[0047] S22. After adding w...

Embodiment 1

[0055] Example 1, compound epoxy resin emulsifier formula and preparation method: put 621 parts of polyetheramine into a 3L three-necked bottle equipped with a stirring and dropping heating device, raise the temperature to 45°C, and then maintain the maximum temperature of 135°C within 0.5 hours °C, 52.5 parts of polyethylene glycol diglycidyl ether were added in 3 batches, and 16.65 parts of E51 type bisphenol A epoxy resin were added in 3 batches within 0.5 hours. After the addition was complete, the temperature was maintained at 125°C for 2 hours. After the heat preservation is completed, add 230.05 parts of octylphenol polyoxyethylene polyoxypropylene ether, and stop heating after the octylphenol polyoxyethylene polyoxypropylene ether is dissolved. Cool naturally and cool the material in the there-necked bottle to 60°C to discharge.

[0056] After the composite epoxy resin emulsifier is prepared, put 1850 parts of polyetheramine E51 type bisphenol A type epoxy resin and 9...

Embodiment 2

[0058] Example 2, compound epoxy resin emulsifier formula and preparation method: Put 730 parts of polyetheramine into a 3L three-necked bottle equipped with a stirring and dropping heating device, raise the temperature to 45°C, and then maintain the maximum temperature of 135°C within 0.5 hours °C, 57.3 parts of polyethylene glycol diglycidyl ether were added in 3 batches, and 26.8 parts of E51 type bisphenol A epoxy resin were added in 3 batches within 0.5 hours. After the addition was complete, the temperature was maintained at 125°C for 2 hours. After the heat preservation is completed, add 253.5 parts of octylphenol polyoxyethylene polyoxypropylene ether, and stop heating after the octylphenol polyoxyethylene polyoxypropylene ether is dissolved. Cool naturally and cool the material in the there-necked bottle to 60°C to discharge.

[0059] After the composite epoxy resin emulsifier is prepared, put 1350 parts of polyetheramine E51 type bisphenol A type epoxy resin and 70 ...

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Abstract

The invention discloses a low-temperature-resistant waterborne epoxy resin and a synthesis and preparation method thereof. The low-temperature-resistant waterborne epoxy resin comprises, by weight, 40-65 parts of epoxy resin and 2-20 parts of a compound epoxy resin emulsifier, and further comprises 20-40 parts by weight of water. According to the invention, good compatibility with the epoxy resin can be provided, the stability and the fluidity of the emulsion can be improved, the emulsifier molecule can be ensured not to be too oleophylic or hydrophilic, a flexible hydrophilic emulsifier can be formed, and a rigid oleophylic emulsifier can also be formed. The two types of emulsifier structures jointly act on epoxy resin emulsification, waterborne epoxy emulsion is compatible with a waterborne curing agent, and the emulsification effect is enhanced. The compounding of various emulsifiers with different structures makes the internal structure of the waterborne epoxy resin more complex, weakens the low-temperature crystallinity of the epoxy resin, and achieves the purpose of low-temperature resistance.

Description

technical field [0001] The invention relates to the field of water-based epoxy coatings, in particular to a low-temperature-resistant water-based epoxy resin and a synthesis preparation method thereof. Background technique [0002] The use of water-based epoxy emulsion is one of the commonly used solutions to solve the problem of difficult emulsification of water-based epoxy curing agent and epoxy resin in the process of cooperating with epoxy resin, resulting in low performance of the cured product. The water-based epoxy emulsion that pre-emulsifies the epoxy resin with an emulsifier has the following advantages in use and application: [0003] 1. After water-based modification, the toxicity and biological impact of epoxy resin are reduced; [0004] 2. Low-viscosity liquefaction, easier to mix with water-based epoxy resin curing agent; [0005] 3. The molecular particle size of epoxy resin is smaller and more uniform, and the state is more stable after mixing with water-b...

Claims

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Application Information

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IPC IPC(8): C08J3/03C08L63/02C09D163/02
CPCC08J3/03C09D163/00C08J2363/02
Inventor 姚翀敬凤
Owner 雅安市弘利展化工有限公司
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