Wave soldering furnace

Abstract

The invention relates to the technical field of welding processing of components of circuit boards, in particular to a wave soldering furnace. The wave soldering circuit comprises a furnace body, a first heating structure, a second heating structure and a conveying structure, the furnace body is provided with a furnace cavity, a feeding end and a discharging end, the feeding end and the discharging end are communicated with the furnace cavity, a preheating area and a welding area are sequentially arranged in the furnace cavity, the preheating area is arranged at the position close to the feeding end, and the welding area is arranged at the position close to the welding area; the first heating structure is arranged in the preheating area and is suitable for heating the circuit board; the second heating structure is arranged in the preheating area and is suitable for heating a via hole in the circuit board; the conveying structure is arranged in the furnace body and is suitable for conveying the circuit board from the feeding end to the preheating area, the welding area and the discharging end in sequence. According to the wave-soldering furnace provided by the invention, the second heating structure independently heats the via hole and the copper foil which are good in heat dissipation effect, so that the temperature in the via hole reaches an ideal tinning temperature, tinning in the via hole is sufficient, and the technological process can be normally adjusted.

Description

technical field [0001] The invention relates to the technical field of component welding processing of circuit boards, in particular to a wave soldering furnace. Background technique [0002] In the field of soldering processing of components of circuit boards, reflow soldering or wave soldering is usually used to realize the soldering processing of components. Wave soldering uses pump pressure to form a solder wave of a specific shape on the surface of the molten liquid solder. When the circuit board with components inserted passes through the solder wave at a certain angle, it forms on the lead welding area of ​​the circuit board and components. Solder joint technology. [0003] The wave soldering furnace is generally equipped with a preheating zone and a welding zone, and the chain conveyor belt transfers the circuit board to be soldered from the preheating zone to the welding zone. During the transmission process of the chain conveyor belt, the circuit board to be sold...

AI Technical Summary

Problems solved by technology

Since most of the parts have strict temperature resistance requirements, such an indiscriminate heating method will cause the temperature of the circuit board body to reach the temperature resistance requirements, but the copper foil on the circuit board has not yet reached the ideal tinning due to the fast heat dissipation. temperature, resulting in insufficient tin in the PTH via hole, and the adjustment of the process encounters a bottleneck

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