Bipolar electrostatic chuck for generic semiconductor manufacturing equipment and manufacturing method of bipolar electrostatic chuck

Abstract

The invention discloses a bipolar electrostatic chuck for generic semiconductor manufacturing equipment and a manufacturing method of the bipolar electrostatic chuck. The bipolar electrostatic chuck comprises a metal matrix upper plate, a metal matrix lower plate, an insulating layer I and an insulating layer II, wherein the insulating layer I and the insulating layer II are positioned on the upper surface of the metal matrix upper plate; a first electrode layer and a second electrode layer are horizontally and uniformly arranged between the first insulating layer and the second insulating layer in a staggered mode, the first electrode layer and the second electrode layer are each composed of a plurality of electrode wires, the width of each electrode wire is 0.5-1 mm, and the distance between the electrode wires is 0.2-1 mm. The first electrode layer and the second electrode layer are respectively connected with two power supply rods positioned in the upper plate of the metal substrate, and when a wafer is adsorbed, voltages with opposite polarities are respectively applied to the two power supply rods, so that static electricity with opposite polarities is formed on the surfaces of the first electrode layer and the second electrode layer. Sufficient adsorption force can be generated on the surface of the electrostatic chuck under low voltage, the probability of discharging when the electrostatic chuck is used is reduced, the static dissipation speed when a wafer or a glass substrate is replaced is increased, and the equipment utilization rate is increased.

Description

technical field [0001] The invention relates to the technical field of pan-semiconductor manufacturing equipment, in particular to a bipolar electrostatic chuck for pan-semiconductor manufacturing equipment and a manufacturing method thereof. Background technique [0002] Electrostatic chucks, also known as electrostatic chucks, are used in processing equipment in the pan-semiconductor industry (chips, panels, optoelectronic industries), such as dry etching equipment, chemical vapor deposition equipment, and ion implantation equipment. They are the core functional components of these equipment. Its main function is to hold wafers or glass substrates during chip or panel processing. [0003] The principle of electrostatic chuck adsorbing wafers or glass substrates: the surface of the electrostatic chuck is provided with upper and lower insulation layers and an electrode layer sandwiched between them. When in use, a voltage is applied to the electrode layer to generate static...

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Problems solved by technology

However, when using this method, it is difficult to make the hollowing and interval of the masking fixture less than 1mm at the same time, and even if it is less than 1mm, it is difficult to stick the double-sided adhesive on the masking fixture without covering the hollowed out part, and When the width of the double-sided tape is too thin, it cannot provide enough adhesive force during the spraying process, and the masking fixture is easy to detach from the electrode surface due to thermal deformation

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