Colorful light-emitting structure and preparation method thereof, light-emitting module and preparation method thereof
A technology of light-emitting structure and light-emitting module, which is applied to electrical components, electric solid-state devices, circuits, etc., can solve the problems of high repair cost, high production cost, short circuit, etc., and achieve the effect of reducing the preparation process steps and difficulty, and the structure is simple
Active Publication Date: 2022-03-01
佛山思坦半导体科技有限公司
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Problems solved by technology
[0003] However, on the one hand, the preparation process of the Micro-LED chip array is complicated; A high-density, high-uniform micron-scale flip-chip solder joint array is prepared on the drive panel by means of a high-density, high-uniformity micron-scale flip-chip solder joint array, and then the technology of combining laser alignment and optical image method is used to improve the alignment and bonding accuracy. This process requires extremely high precision. High, high production cost, and prone to defective problems such as virtual soldering and short circuit, resulting in high repair costs
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[0024] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without creative efforts fall within the protection scope of the present invention.
[0025] refer to Figure 1~3 , the present invention discloses a color light-emitting structure, including a transistor 10 and an electroluminescent layer 20, the transistor 10 drives the electroluminescent layer 20 to emit light; the transistor 10 includes a conductive layer 11, and the conductive layer 11 includes a source region 111, a drain region 112 and the channel region 113 located between the source region 111 and the drain region 112 , the electroluminesce...
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The invention discloses a color light-emitting structure and a preparation method thereof, and a light-emitting module and a preparation method thereof, the color light-emitting structure comprises a transistor and an electroluminescent layer, and the transistor drives the electroluminescent layer to emit light; the transistor comprises a conducting layer, the conducting layer comprises a source electrode region, a drain electrode region and a channel region located between the source electrode region and the drain electrode region, and the electroluminescent layer is arranged on the surface of the source electrode region and / or the drain electrode region of the conducting layer. According to the color light-emitting structure, only the electroluminescent layer needs to be arranged on the conducting layer of the transistor, a Micro-LED chip array does not need to be prepared, and a flip-chip bonding technology does not need to be used, so that the structure is simpler, and the preparation process steps and difficulty are greatly reduced.
Description
technical field [0001] The present invention relates to the field of light-emitting display technology, and more specifically, to a color light-emitting structure and a preparation method thereof, a light-emitting module and a preparation method thereof. Background technique [0002] In the prior art, the light-emitting module includes a light-emitting panel and a driving panel arranged under the light-emitting panel. The driving panel drives the light-emitting panel to emit light. The driving panel includes a transistor array, and the light-emitting panel includes an array of Micro-LED chips. Combining the driving panel and the light-emitting panel When they are together, they are usually integrated by flip-chip technology. [0003] However, on the one hand, the preparation process of the Micro-LED chip array is complicated; A high-density, high-uniform micron-scale flip-chip solder joint array is prepared on the drive panel by means of a high-density, high-uniformity micr...
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IPC IPC(8): H01L27/15H01L27/32
CPCH01L27/15H10K59/00
Inventor 邱成峰管云芳莫炜静
Owner 佛山思坦半导体科技有限公司