Millimeter wave packaging antenna based on fan-out packaging technology

A packaging process, millimeter wave technology, applied in antennas, antenna parts, antenna supports/installation devices, etc., can solve the problems of reduced antenna transmission performance, large signal attenuation and attenuation, large signal transmission distance, etc. The effect of shortening transmission distance, reducing attenuation and loss, and improving transmission performance

Pending Publication Date: 2022-03-01
GUANGDONG UNIV OF TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] However, fan-out packaging is not yet mature enough for the packaging of millimeter-wave chips and antenna structures. There is a large signal transmission distance between the antenn

Method used

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  • Millimeter wave packaging antenna based on fan-out packaging technology
  • Millimeter wave packaging antenna based on fan-out packaging technology
  • Millimeter wave packaging antenna based on fan-out packaging technology

Examples

Experimental program
Comparison scheme
Effect test

Example Embodiment

[0032] Example 1

[0033] See figure 1 This embodiment proposes a millimeter wave package antenna based on the fan out of the packaging process, including the chip package layer 1, an antenna radiation structure 2, an external substrate pad 3, a reflective metal layer 4, and a first passivation layer 5; The outer substrate pad 3 is disposed under the chip package layer 1, the reflective metal layer 4 is disposed above the chip package layer 1; the first passivation layer 5 is disposed at the reflective metal layer 4. Above, the antenna radiation structure 2 is disposed above the first passivation layer 5; the antenna radiation structure 2 signals by a conductor and a chip package layer 1; the chip package layer 1 is welded by a conductor and an external substrate. The disc 3 performs signal transmission.

[0034] In the specific implementation process, the antenna radiation structure 2 is directly transmitted by the conductor to signal the chip package layer 1 to feed the chip pac...

Example Embodiment

[0035] Example 2

[0036] See Figure 2- Figure 10 In this embodiment, a millimeter wave package antenna based on the fan out of the packaging process includes the outer substrate pad 3, the chip package layer 1, the reflective metal layer 4, the first passivation layer 5, and Antenna radiation structure 2, and at least one first signal through hole 6 and at least one second signal through hole 7; the first signal through hole 6 is provided through the first passivation layer 5 and the reflective metal layer 4, and One end of the signal through hole 6 is connected to the antenna radiation structure 2, and the other end is connected to the chip package layer 1, the antenna radiation structure 2 signals to the chip package layer 1 by the first signal through hole 6; The two-signal through hole 7 is disposed within the chip package layer 1, the chip package layer 1 signals through the second signal through hole 7 with the external substrate pad 3.

[0037] In this embodiment, the firs...

Example Embodiment

[0048] Example 3

[0049] This embodiment proposes a millimeter wave package antenna based on the fan out of the packaging process, wherein the millimeter wave-bearing chip 101 includes a chip floor 1011, and the millimeter wave package antenna further comprises at least one third signal through hole 8 and at least one Four signal through holes 9; the reflected metal layer 4 communicates with the chip floor 1011 by the third signal through hole 8; the reflective metal layer 4 is passed through the fourth signal through hole 9 and the outer substrate pad. 3.

[0050] In the specific implementation process, the reflected metal layer 4 communicates with the chip floor 1011 by the third signal through hole 8; the reflected metal layer 4 passes through the fourth signal through hole 9 and the outer substrate pad. 3 Connect, realize the chip floor 1011, the reflected metal layer 4 is connected to the reference potential point of the external substrate pad 3, can form a common ground wit...

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PUM

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Abstract

The invention provides a millimeter wave packaging antenna based on a fan-out packaging technology. The millimeter wave packaging antenna comprises a chip packaging layer, an antenna radiation structure, an external substrate bonding pad, a reflection metal layer and a first passivation layer. The external substrate bonding pad is arranged below the chip packaging layer, and the reflective metal layer is arranged above the chip packaging layer; the first passivation layer is arranged above the reflective metal layer, and the antenna radiation structure is arranged above the first passivation layer; the antenna radiation structure carries out signal transmission with the chip packaging layer through the conductor. And the chip packaging layer performs signal transmission with the external substrate bonding pad through the conductor. According to the antenna structure, signal transmission is directly carried out through the conductor and the chip packaging layer, and the chip packaging layer is longitudinally and electrically connected with the bonding pad of the external substrate, so that the signal transmission distance between the antenna and the chip is greatly shortened, attenuation and loss of signals in the transmission process are effectively reduced, and the transmission performance of the antenna is improved.

Description

technical field [0001] The present invention relates to the field of packaged antennas, and more particularly, relates to a millimeter-wave packaged antenna based on fan-out packaging. Background technique [0002] With the rapid development of wireless communication technology, people have higher and higher requirements for data transmission rate. The fifth-generation mobile communication technology (5G) is the latest generation of cellular mobile communication technology, which uses millimeter-wave band communication to increase communication capacity, thereby greatly improving the quality and rate of data transmission. Therefore, millimeter-wave antenna-in-package technology will be an important development direction in the communication field in the future. [0003] Fan-out packaging is a popular direction for packaging millimeter-wave chips and antenna structures in recent years. Its advantages such as high input and output density and integration flexibility, as well ...

Claims

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Application Information

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IPC IPC(8): H01Q1/22H01Q1/50H01Q1/00H01L23/66
CPCH01Q1/2283H01Q1/50H01Q1/002H01L23/66H01L2223/6677
Inventor 张俊何启明朱红博杨立森徐莎陈卓著
Owner GUANGDONG UNIV OF TECH
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