Bulk material chip mounting tray based on full-automatic chip mounter

Abstract

The invention relates to a bulk chip mounting tray based on a full-automatic chip mounter, which comprises a supporting plate (1) and a group of packaging boxes (2), the upper surface of the supporting plate (1) is provided with a group of mounting grooves (3), each mounting groove (3) is matched with the corresponding packaging box (2) in appearance and clearance fit, the bottom of each packaging box (2) is arranged at the bottom of the corresponding mounting groove (3), the top surface of each packaging box (2) is flush with the upper surface of the supporting plate (1), and the upper surface of the supporting plate (1) is provided with a plurality of mounting grooves (3). The supporting plate (1) is detachably connected to a chip mounter bracket (4). According to the invention, through cooperation with full-automatic mounting equipment, the purpose of small-scale, batch, high-efficiency and high-quality mounting of multi-specification bulk materials is realized.

Description

technical field [0001] The invention relates to the technical field of surface assembly of hybrid integrated circuits, in particular to a bulk material placement tray based on a fully automatic placement machine. Background technique [0002] As the number of newly developed products increases, the demand for small-batch trial production of circuits and secondary screening of components for high-reliability circuits also increases accordingly, which causes more and more circuits to be processed in bulk. [0003] At present, most automatic placement machines have certain requirements for the packaging of components, such as tape and reel packaging, cylindrical packaging, this method is only suitable for mass production to reduce production costs; vibration feeders are suitable for small quantities There are many bulk materials, which cannot be used for small batches of bulk materials, and occupy the patch material position, and the types of operable components are limited; in...

AI Technical Summary

Problems solved by technology

[0002] As the number of newly developed products increases, the demand for small-batch trial production of circuits and secondary screening of components for high-reliability circuits also increases accordingly, which causes more and more circuits to be processed in bulk

[0003] At present, most automatic placement machines have certain requirements for the packaging of components, such as tape and reel packaging, cylindrical packaging, this method is only suitable for mass production to reduce production costs; vibration feeders are suitable for small quantities There are many bulk materials, which cannot be used for small batches of bulk materials, and occupy the patch material position, and the types of operable components are limited; in addition, there is also a short-belt feeder to match the patch, but this method is suitable for shorter Taping, and the procurement cost is high; at this stage, for small batches of loose chips, more manual placement is used, but manual placement has low placement efficiency, long cycle, and solder cannot be welded in time, which affects There are many problems such as circuit reliability. At the same time, components are easy to be misplaced, and the cost of circuit analysis is also increased.

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