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Mould pressing device for fluorescent glue for illumination and illumination production process

A fluorescent glue, fluorescent glue layer technology, applied in electrical components, semiconductor/solid-state device manufacturing, circuits, etc., can solve the problem of chip pins being easily pressed and used normally, to improve control stability, improve overall quality, improve The effect of pass rate

Pending Publication Date: 2022-03-04
深圳市中美欧光电科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] In order to improve the problem that the pins of the chip are easily pressed and affect normal use when the fluorescent adhesive layer is molded, this application provides a fluorescent adhesive molding device for lighting and a lighting production process

Method used

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  • Mould pressing device for fluorescent glue for illumination and illumination production process
  • Mould pressing device for fluorescent glue for illumination and illumination production process
  • Mould pressing device for fluorescent glue for illumination and illumination production process

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Embodiment Construction

[0044] The following is attached Figure 2-4 The application is described in further detail.

[0045] The embodiment of the application discloses a fluorescent glue molding device for lighting and a lighting production process.

[0046] refer to figure 2 and image 3 , the fluorescent plastic molding device for lighting includes a lower mold base 2 and an upper mold base 4, the lower mold base 2 is fixed with a lower template 3, the upper mold base 4 is equipped with an upper template 6, the upper template 6 is connected with a pressure column 9, and the upper mold base 4. A power part 7 that is connected with the pressure column 9 and can drive the pressure column 9 to move up and down is installed.

[0047] refer to figure 2 , the lower mold base 2 is a rectangular plate as a whole, and the four corners of the lower mold base 2 are respectively vertically fixed with guide posts. The upper mold base 4 is a rectangular plate as a whole, and the four corners of the upper...

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Abstract

The invention relates to a fluorescent glue mold pressing device for illumination and an illumination production process, and relates to the technical field of illumination production, the mold pressing device comprises an upper mold base and a lower mold base, and the fluorescent glue mold pressing device further comprises a lower mold plate fixed to the lower mold base and provided with a positioning groove used for installing a bottom plate; the upper mold plate is installed on the upper mold base, one face, away from the upper mold base, of the upper mold plate is provided with at least one mold cavity matched with the outline of the fluorescent glue layer, the face, away from the upper mold base, of the upper mold plate is further provided with a pin receding groove, and the pin receding groove is communicated with the mold cavity; the pressing column is located in the die cavity and can slide along the axis relative to the upper die plate; the power piece is connected between the pressing column and the upper die base and used for driving the pressing column to move relative to the upper die plate. According to the production process, hemispherical fluorescent glue is flattened into a fluorescent glue layer by applying the fluorescent glue mould pressing device for illumination. The method has the advantage that the chip pins are protected from being crushed during fluorescent glue mold pressing.

Description

technical field [0001] The application relates to the technical field of lighting production, in particular to a fluorescent glue molding device for lighting and a lighting production process. Background technique [0002] LED light sources have the advantages of small size, long life, high efficiency and energy saving, etc., and are widely used in the field of lighting. Due to the low color rendering of LED lights in white lighting, the color rendering index will be improved by adding phosphors. [0003] For related technologies, please refer to the patent with the authorized announcement number CN204155958U, which discloses a chip-on-chip packaging light source, including a substrate, a chip assembly composed of light-emitting diode chips arranged on the substrate through a die-bonding process, and a chip assembly molded outside the chip assembly. Fluorescent glue layer. [0004] figure 1 It is a structural schematic diagram of an illumination source. The illumination s...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/67H01L33/50H01L33/62
CPCH01L33/62H01L33/50H01L21/67121H01L21/67144
Inventor 王强殷仕乐
Owner 深圳市中美欧光电科技有限公司
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