Low-pressure corrosion device and method for quartz microwell plate

A technology of corrosion device and micro-orifice plate, which is applied in the field of processing technology, can solve the problems of uneven single micro-hole and different corrosion rates, and achieve the effects of remarkable corrosion effect, uniform corrosion rate and simple operation.

Active Publication Date: 2022-03-11
HARBIN ENG UNIV
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Problems solved by technology

However, during the corrosion process of the microporous plate, the corrosion solution precipitates microbubbles due to heating, agitation, etc., and easily attaches to the micropores, so that the quartz there will not come into contact with the corrosion solution, which will cause the corrosion rate of each micropore to be different. , and a single micropore will also be uneven

Method used

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  • Low-pressure corrosion device and method for quartz microwell plate

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Embodiment Construction

[0017] A kind of quartz microporous plate low-pressure etching method provided by the invention comprises the following steps:

[0018] 1) Configure the solution required for corrosion.

[0019] 2) Connect the air pump 6, the first solution cup 2, the second solution cup 5, the corrosion cup 3, the conduit and the air valve together as shown in the figure.

[0020] 3) Put the corrosion solution into the first solution cup 2, put the microporous plate 6 into the corrosion cup 3, and seal all the joints well to ensure no air leakage.

[0021] 4) Perform solution replacement according to certain steps, repeat several times, so that the corrosion solution exists in the corrosion cup 3 and the air pressure is as low as possible.

[0022] 5) Open the corrosion cup 3, put it together with the corrosion solution in it and the microporous plate 6 under the condition of specified temperature and corrode for a certain period of time.

[0023] The technical solution of the present inven...

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Abstract

The invention discloses a low-pressure corrosion method for a quartz microwell plate, and belongs to the field of processing technologies. When the size of micropores in the quartz micropore plate is smaller than the required size, a corrosion reaming method is provided. According to the method, the purpose of enlarging the micropore diameter is achieved by corroding the quartz plate through the corrosion solution, and due to the fact that bubbles exist in the corrosion solution, uneven corrosion can be caused, the low-pressure corrosion method is provided, the number of the bubbles in the solution can be reduced, and the corrosion rate of the quartz micropore plate is more balanced. The device for manufacturing the low pressure is composed of a vacuum air pump, a first solution cup, a second solution cup, a corrosion cup, a corrosion solution, several air valves and a connecting guide pipe, the corrosion cup can be pumped to be close to vacuum through specific operation steps, bubbles are separated out, and uniform corrosion of the solution to the microwell plate is facilitated.

Description

technical field [0001] The invention relates to the field of processing technology, in particular to a low-pressure etching device and method for a quartz microporous plate. Background technique [0002] In some special applications, quartz microplates with a large number of pores are required. During the actual processing of quartz microwell plates, due to factors such as excessive manufacturing errors or unreasonable design, the diameter of micropores on the actual plate may be slightly smaller than required. In this case reprocessing will consume a lot of cost and time. For the expansion of a large number of quartz micropores, the method of solution corrosion can be used. However, during the corrosion process of the microporous plate, the corrosion solution precipitates microbubbles due to heating, agitation, etc., and easily attaches to the micropores, so that the quartz there will not come into contact with the corrosion solution, which will cause the corrosion rate o...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C03C15/00
CPCC03C15/00Y02P70/50
Inventor 孙伟民严云翔刘世杰陈旭东耿涛闫奇王佳斌金夕人
Owner HARBIN ENG UNIV
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