System for testing thermal deformation performance of aviation temperature sensitive element

Abstract

The invention provides a thermal deformation performance test system for an aviation temperature sensitive element. The thermal deformation performance test system comprises a base; the temperature control box is arranged on the base; the deformation and stress load testing device is arranged in the temperature control box and is used for testing elements; the power device is connected with the deformation and stress load testing device and used for providing acting force for the deformation and stress load testing device; the protection device is arranged above the temperature control box; wherein the power device is arranged in the protection device; the protection device is connected with the base through a stand column. The aviation temperature sensitive element thermal deformation performance test system provided by the invention is wide in applicable temperature range, small in error, high in precision, stable in operation, high in automation degree, simple and convenient to operate and easy to popularize and apply.

Description

technical field [0001] The application belongs to the technical field of mechanical performance testing, and in particular relates to a thermal deformation performance testing system of an aviation temperature sensitive element. Background technique [0002] The development of the aviation industry is closely related to engineering applications, but more importantly, the tremendous progress that mankind has made in this industry sector has had a significant and far-reaching impact on many sectors of the national economy and many aspects of social life, driving and changing face of the world. Various materials used in aircraft and its power plants, accessories, and instruments are one of the decisive factors in the development of aerospace engineering technology. The emergence of various new materials and new technologies also provides new and greater possibilities for the development of aircraft, which greatly promotes the development of aerospace technology. Because aviat...

AI Technical Summary

Problems solved by technology

[0004] Measuring thermal deformation of devices is a complex and difficult process

Due to the temperature rise, the measurement device itself, such as the error caused by the temperature change of the electronic components, the error caused by the mechanical fixture, the thermal shock deformation error, the thermal deformation of the box, etc., all of which increase the difficulty of measurement.

[0005] For the thermal deformation test of mechanical devices or components with strong temperature sensitivity, the traditional temperature-sensitive component thermal deformation test system has a series of problems such as large error, low measurement accuracy, low degree of automation, and low measurement efficiency, which need to be improved urgently

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