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High-brightness thinned miniled backlight structure

A backlight structure and high-brightness technology, which is applied in optics, nonlinear optics, instruments, etc., can solve the problems of rising cost and difficulty in meeting the thickness requirements of ultra-thin products, so as to reduce the number of materials, facilitate backlight assembly, and meet thin the effect of demand

Pending Publication Date: 2022-03-15
HANBO HIGH TECH MATERIALS HEFEI CO LTD
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] Multiple structural diffusion films are placed above the light panel to shield the LED dot mura. The total thickness of multiple structural diffusion films and printed dot diffusion plates required by this solution is usually relatively thick, which is difficult to meet the thickness requirements of ultra-thin products. And in order to reduce the thickness of the product as much as possible, it is necessary to reduce the miniled pitch and increase the number of LEDs, resulting in a significant increase in cost

Method used

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  • High-brightness thinned miniled backlight structure

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Embodiment Construction

[0023] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without creative efforts fall within the protection scope of the present invention.

[0024] In describing the present invention, it is to be understood that the terms "opening", "upper", "lower", "thickness", "top", "middle", "length", "inner", "surrounding" etc. Indicating orientation or positional relationship is only for the convenience of describing the present invention and simplifying the description, and does not indicate or imply that the components or elements referred to must have a specific orientation, be constructed and operated in a sp...

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Abstract

The high-brightness thinned miniled backlight structure comprises a back plate, a PDLC dimming film is arranged in the back plate, the PDLC dimming film comprises two PET base materials and a refraction layer, the refraction layer is located between the two PET base materials, an ITO conductive circuit is arranged on the side, close to the refraction layer, of each PET base material, and the ITO conductive circuit is arranged on the other side, close to the refraction layer, of each PET base material. The refraction layer comprises a polymer and a liquid crystal, the number of the PDLC light adjusting films is two, and a transparent isolating film is arranged between the two PDLC light adjusting films. According to the high-brightness thinned miniled backlight structure, the PDLC light adjusting films are adopted to replace a plurality of structural diffusion films in backlight, the product thickness can be greatly reduced, the thinned requirement of the product is met, and the high-brightness thinned miniled backlight structure is suitable for large-scale popularization and application. Meanwhile, the number of materials is reduced, backlight assembly is facilitated, LED arrangement pitches can be added in ultrathin products, the number of LEDs is reduced, and the problems that the layout space of a lamp panel is insufficient and the layout space of a PCB is insufficient are solved.

Description

technical field [0001] The invention relates to the technical field of backlight production and manufacturing, in particular to a high-brightness and thinned miniled backlight structure. Background technique [0002] Miniled technology products have many advantages such as high brightness, high contrast, and partition control to save power consumption. According to product specification requirements, they can be applied to products of different sizes from mobile phones to TVs. [0003] In traditional miniled backlight material stacking such as Figure 1 As shown, from bottom to top are light board, BLT, QD, multiple structural diffusion films, BEF, and upper diffusion film; Figure II As shown, from bottom to top are the lamp panel, BLT, QD, multi-layer structure diffusion film, BEF, and upper diffusion film. [0004] Multiple structural diffusion films are placed above the light panel to shield the LED dot mura. The total thickness of multiple structural diffusion films an...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G02F1/13357G02F1/1334
CPCG02F1/1336G02F1/133601G02F1/133603G02F1/1334
Inventor 范海标陈伟峰
Owner HANBO HIGH TECH MATERIALS HEFEI CO LTD
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