Fixing member for cutting electronic component blank and cutting method
A technology for electronic components and fixed components, which is applied in the direction of fixed capacitor parts, electrical components, fixed capacitor dielectrics, etc., can solve the problems of unable to suppress cracks, unable to suppress cracks in the parent laminate, and achieve the effect of suppressing cracks
Pending Publication Date: 2022-03-15
MURATA MFG CO LTD
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Problems solved by technology
[0008] The inventors of the present application have made investigations and found that when the mother laminate is fixed and cut with a fixing sheet as in the cutting method described in Patent Document 1, the occurrence of cracks cannot be suppressed due to the characteristics of the fixing sheet.
That is, simply cutting the mother laminate by fixing it with the fixing sheet may not be able to suppress the generation of cracks in the mother laminate.
Method used
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Embodiment Construction
[0056] Embodiments of the present invention are shown below, and features of the present invention will be described in detail.
[0057]
[0058] figure 1 It is a side view which schematically shows the structure of the fixing member 10 for cutting of the electronic component blank in 1st Embodiment of this invention. The fixing member 10 for cutting an electronic component body in the first embodiment includes a base material 1 and a restraint arranged on the first main surface 1 a of the base material 1 and fixing the electronic component body 20 placed thereon. material layer 2.
[0059] The substrate 1 includes, for example, polyethylene, polypropylene, polyethylene terephthalate, polyamide, polycarbonate, polyacetal, polybutylene terephthalate, or polyimide. The substrate 1 has, for example, a sheet shape, and its thickness is, for example, 0.001 mm to 10 mm. When a flexible material made of a material having a low Young's modulus is used as the base material 1 , it ...
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Abstract
The invention provides a fixing member for cutting an electronic component blank and a cutting method, which can restrain the generation of cracks when the electronic component blank is cut by a cutting knife. A fixing member (10) for an electronic component blank is provided with a base material (1), and a restraining material layer (2) that is disposed on a first main surface (1a) of the base material (1) and fixes an electronic component blank (20) placed thereon. The Young's modulus of the constraining material layer (2) in the direction parallel to the first main surface (1a) of the base material (1) is 0.12 GPa or more and 10 GPa or less.
Description
technical field [0001] The present invention relates to a cutting fixing member used when cutting an electronic component body and a cutting method of an electronic component body. Background technique [0002] When manufacturing an electronic component such as a laminated ceramic capacitor, a method is known in which a plurality of ceramic green sheets on which internal electrode patterns are formed are stacked to form a mother laminate, and the mother laminate is cut with a cutting blade, whereby the single-chip After turning into a plurality of unfired laminated bodies, firing is performed. [0003] Patent Document 1 describes a method in which a pressure-bonded block as a mother laminate is adhesively fixed to a sheet for fixing, and the pressure-bonded block is set on a cutting table via the sheet for fixing, and the pressure-bonded block is cut off by a cutting blade. cut off. According to this cutting method, it is possible to prevent the occurrence of positional de...
Claims
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IPC IPC(8): H01G13/00H01G4/30H01G4/12
CPCH01G13/00H01G4/30H01G4/12
Inventor 木村祐太
Owner MURATA MFG CO LTD