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Cyanide-free bright silver plating solution and electroplating method

A solution and silver electroplating technology, applied in electrolytic components, electrolytic processes, cells, etc., can solve the problems of polluted environment, poor stability, poor dispersion ability, etc., and achieve the effect of simple plating solution, good stability, and reduced harm.

Active Publication Date: 2022-03-22
CHONGQING UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The traditional cyanide-containing silver plating solution is highly toxic, seriously pollutes the environment, endangers the health of producers, and the cost of waste liquid treatment is high, so cyanide-free silver plating can be developed
However, when targeting certain substrates, especially copper substrates, the current cyanide-free silver plating solutions still have problems such as poor stability, poor dispersion ability, and weak bonding between the coating and the substrate.

Method used

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  • Cyanide-free bright silver plating solution and electroplating method
  • Cyanide-free bright silver plating solution and electroplating method

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0026] Configuring a cyanide brightening silver plated solution: silver nitrate 20g / L, 2,4-imidazolinothenone 20g / L, 5,5-dimethylcyl urea 60 g / L, potassium carbonate 60g / L, PE Alcohol (400) 1 g / l.

[0027] Cleaning the copper base: The pressure of the potassium hydroxide solution of 10% is provided, and the substrate is placed in a solution of 5 min, water washing, and the volume fraction is 20% sulfuric acid solution, and the substrate is placed in a solution for 10 min, and the water was washed dried.

[0028] Put the processed substrate into the electroplated solution, the constant temperature water bath 40 ° C, the cathode current density is 0.3A / DM 2 The pulse width of the single pulse power supply is 30s, the duty cycle is 25%, and the electroplating is stopped 5 times in the pulse cycle (the plating layer reaches a suitable thickness).

[0029] The surface of the silver plating surface of the present embodiment has a micro-morphology SEM map figure 1 As shown, t...

Embodiment 2

[0032] Configuring a cyanopide brightening silver plated solution, silver nitrate 20g / L, 2,4-imidazolinonidone 50 g / l, 5,5-dimethylcyl urea 60 g / L, potassium carbonate 60g / L, PE 2 Alcohol (400) 1 g / l.

[0033] Cleaning the copper base: The pressure of the potassium hydroxide solution of 10% is provided, and the substrate is placed in a solution of 5 min, water washing, and the volume fraction is 20% sulfuric acid solution, and the substrate is placed in a solution for 10 min, and the water was washed dried.

[0034] Put the processed substrate into an electroplated solution, a constant temperature water bath 40 ° C, the control cathode current density is 0.3A / DM 2 The pulse width of the single pulse power supply is 30s, the duty ratio is 25%, and the electroplating is stopped after the pulse cycle is 5 times.

[0035] Silver plating surface micro morphology SEM map figure 2 As shown, the surface is equally confirmed.

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Abstract

The invention discloses a cyanide-free bright silver plating solution and an electroplating method. The silver electroplating solution comprises 10-30 g / L of silver nitrate; 10 to 80 g / L of 2, 4-imidazolinedione; 5, 5-dimethyl hydantoin with a concentration of 40 to 100 g / L; 40-100 g / L of potassium carbonate; and 0.3-2 g / L of polyethylene glycol. According to the method, the specially designed cyanide-free silver plating solution is utilized, and the pulse current is adopted, so that the silver plating layer with excellent binding force and excellent plating layer surface performance is obtained on the copper substrate, especially the red copper substrate.

Description

Technical field [0001] The present invention relates to electroplating technology on a copper base. Background technique [0002] Electroplating is widely used in printed wiring boards, electronic components, instrumentation, aircraft, optical instruments, and communication equipment. The traditional cyanopide-plated solution has a highly toxic, severe contaminated environment, hazardizing the health of the producer, and the waste liquid treatment cost is high, and there is cyaninite. However, when certain substrates, especially for the copper base, there is still a problem with poor stability, poor dispersion, and weakness of the coating and substrate bonding force. Inventive content [0003] One of the objects of the present invention is to provide a no-cyanopenia-free silver plating solution having a good stability and a good dispersion ability. [0004] The electroplated solutions provided in accordance with the present invention include: [0005] 10-30 g / L silver nitrate;...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C25D3/46C25D21/12
CPCC25D3/46C25D21/12
Inventor 黎学明龚子雯周善斌熊路杨文静
Owner CHONGQING UNIV
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