Wafer processing equipment

Abstract

The invention belongs to the technical field of semiconductor processing, and particularly relates to wafer processing equipment which comprises a movable frame, a driven rod, a limiting plate, a light receiver and a warning lamp, under the cooperation of a first reed, a roller on one side is attached to the surface of a wafer to press and fix the wafer, and a roller on the other side presses waste materials to guarantee that the waste materials are not damaged after cutting. Waste materials are not adhered, meanwhile, it is guaranteed that the cutting side is not deformed, it is guaranteed that tearing damage does not exist in the wafer cutting process, the integrity of the wafer is guaranteed, the cutting yield is improved, needle head swinging is achieved, the inner wall of a notch of an electrode ring makes contact with an electrode ball, an alarm can be powered on, an alarm can be given out, and meanwhile an alarm signal is transmitted into a PLC processor. A shutdown command is issued through the PLC processor, shutdown operation is achieved, scrapped wafers are processed, meanwhile, equipment is maintained, the accuracy of follow-up operation is guaranteed, the cutting quality of the wafers is guaranteed, the yield is improved, the cutting stability is monitored, and the production efficiency can be improved.

Description

technical field [0001] The invention belongs to the technical field of semiconductor processing, in particular to wafer processing equipment. Background technique [0002] A semiconductor refers to a material whose conductivity at room temperature is between that of a conductor and an insulator. Semiconductors are widely used in radios, televisions, and temperature measurement. For example, diodes are devices made of semiconductors. A semiconductor refers to a material whose conductivity can be controlled and ranges from an insulator to a conductor. Whether from the perspective of technology or economic development, the importance of semiconductors is very huge. Most of today's electronic products , such as computers, mobile phones or digital recorders, the core units are closely related to semiconductors. Common semiconductor materials include silicon, germanium, gallium arsenide, etc., and silicon is among various semiconductor materials. It is widely used in commercial a...

AI Technical Summary

Problems solved by technology

[0007] In order to make up for the deficiencies of the existing technology, it needs to be cut during the processing of the wafer. During the cutting process, waste will be generated, and the waste and the wafer are easily adhered, resulting in tearing and deformation of the wafer. After deformation, It cannot be found in time, and continuing processing will affect the yield of processing. At the same time, after cutting, multi-process inspection is required, which affects the processing efficiency. A wafer processing equipment proposed by the present invention

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