Process for simply preparing directionally-sorted carbon fiber heat-conducting composite material in laboratory

Abstract

The invention discloses a process for simply preparing a directionally ordered carbon fiber heat-conducting composite material in a laboratory, which comprises the following steps: S1, preparing strip-shaped base materials: adding a carbon fiber heat-conducting composite material base material into a dispensing pipe, and extruding a piston of the dispensing pipe at a constant speed to prepare a plurality of strip-shaped base materials; the cross sectional area of the lower end of the glue outlet is smaller than that of the cavity of the dispensing pipe; s2, arranging, curing and forming: sequentially arranging a plurality of strip-shaped base materials in parallel along the extrusion direction, and performing high-temperature curing and forming; s3, cutting: after the strip-shaped base material is cooled, cutting the strip-shaped base material at equal intervals according to a preset interval, and cutting the strip-shaped base material into a plurality of small sections of base materials with the same interval; and S4, splicing is conducted, specifically, the small sections of base materials are turned over by 90 degrees and arranged in sequence again, and the carbon fiber heat conduction composite material assembled sheet with the uniform thickness is obtained. The method does not need to customize a special extruding and slicing machine, and has the effects that the test sheet can be prepared by using a common device, and the carbon fibers can be directionally sequenced in the test sheet.

Description

technical field [0001] The present application relates to the technical field of high thermal conductivity composite materials, in particular to a process for simply preparing directional and sorted carbon fiber thermal conductivity composite materials in a laboratory. Background technique [0002] In recent years, with the improvement of people's living standards and the advent of the 5G era, various electrical components have higher and higher requirements for electronic chips. As the power of various electronic devices continues to increase, their calorific value also continues to increase. If the heat dissipation problem of electronic devices cannot be well solved, the service life and safety of electronic devices will be greatly affected. Therefore, the requirements for heat dissipation of electronic devices are getting higher and higher. [0003] At present, the thermal conductivity of thermal interface materials prepared by traditional thermal conductive fillers most...

AI Technical Summary

Problems solved by technology

Due to the isotropy of traditional thermally conductive fillers, the molding process of the base material basically has no effect on the thermal conductivity of the thermally conductive composite material. However, according to the traditional process of molding / roll vulcanization molding, the arrangement of carbon fibers in the sheet will be disordered, which cannot be achieved. The effect of the axial arrangement of the heat conduction direction, so the real thermal conductivity of the carbon fiber thermal conductive composite material cannot be presented

[0005] In order to make the carbon fiber oriented in the direction of heat conduction, the traditional process mainly adopts the method of magnetic field or mechanical extrusion, and then molding, which consumes more raw materials and also requires customized extrusion tools and molding dies. slicing machine

Small laboratories often do not have these conditions for preparation, which makes it very inconvenient to test thermal conductivity

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