Strong-viscosity insulating non-silicon heat-conducting gasket

Abstract

The invention discloses a strong-viscosity insulating non-silicon heat-conducting gasket, which is prepared by the following main steps: (1) pretreating heat-conducting powder to form modified mixed powder, (2) preparing heat-conducting colloid by using the modified mixed powder and other components, and (3) adding an epoxy curing agent into the heat-conducting colloid, and stirring to form the non-silicon heat-conducting gasket. The heat-conducting colloid is mainly prepared from octyl acrylate, styrene, acrylic acid, modified mixed powder and an initiator. According to the high-viscosity insulating non-silicon heat-conducting gasket, a non-silicon system is adopted, the acrylic resin is used as a matrix, and the heat-conducting powder is filled to manufacture the heat-conducting gasket, so that the problem of smudginess caused by permeation is solved, the viscosity of the gasket is improved, the heat conductivity coefficient of the non-silicon heat-conducting gasket is greatly improved, the heat conductivity coefficient of the non-silicon heat-conducting gasket is as high as 5W / mK, and the 180-degree stripping force of the non-silicon heat-conducting gasket is as high as 5N / in or above.

Description

technical field [0001] The invention relates to the technical field of heat-conducting materials, in particular to a strong-adhesive insulating non-silicon heat-conducting pad. Background technique [0002] Thermal pads are usually used in ICs or integrated circuits. Traditional insulating thermal pads are mostly silicon systems. Silicone oil is easy to penetrate when pasted on the surface of IC / integrated circuits, forming dirt and inconvenient for subsequent operations. Non-silicon thermal pads on the market The thermal conductivity of the gasket is mostly within 3W / mK. [0003] For this reason, we propose a strong adhesive insulating non-silicon thermal pad to solve the above problems. Contents of the invention [0004] The purpose of the present invention is to provide a non-silicon heat-conducting gasket with strong adhesion and insulation, which adopts a non-silicon system, uses acrylic resin as a matrix, and fills with heat-conducting powder to make a heat-conducti...

AI Technical Summary

Problems solved by technology

[0002] Thermally conductive gaskets are usually used in ICs or integrated circuits. Traditional insulating thermally conductive gaskets are mostly silicon systems. Silicone oil is easily permeated when pasted on the surface of IC / integrated circuits, forming dirt and inconvenient for subsequent operations. Non-silicon thermally conductive gaskets on the market The thermal conductivity of the gasket is mostly within 3W / mK