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Fast flushing and quick discharge tank for integrated circulation cooling and cleaning of semiconductor wafers

A cyclic cooling, semiconductor technology, applied in the field of semiconductor wafer processing, fast flushing and fast slotting, can solve the problems of surface residue, damage, uneven cleaning, etc., to achieve the effect of cleaning the wafer thoroughly and avoiding damage

Active Publication Date: 2022-05-17
ZHICHENG SEMICON EQUIP TECH (KUNSHAN) CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The object of the present invention is to provide a fast-flushing and fast-discharging tank for integrated circulation cooling and cleaning of semiconductor wafers in order to solve the above problems, so as to solve the wafer cleaning method in the prior art, which usually involves chaotic batches of wafers being loaded into flower baskets Cleaning, during the cleaning process, the contact position of the flower basket and the wafer is often not cleaned, which is prone to problems of uneven cleaning and surface residue after cleaning. This cleaning method is also likely to cause damage to the crystal when shaking, resulting in cost the increased problem of

Method used

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  • Fast flushing and quick discharge tank for integrated circulation cooling and cleaning of semiconductor wafers
  • Fast flushing and quick discharge tank for integrated circulation cooling and cleaning of semiconductor wafers
  • Fast flushing and quick discharge tank for integrated circulation cooling and cleaning of semiconductor wafers

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Embodiment Construction

[0039] Embodiments of the present invention provides a fast-flush fast-loading groove for semiconductor wafer integrated circulating cooling cleaning.

[0040] See Figure 1 、 Figure 2 、 Figure 3 、 Figure 4 、 Figure 5 、 Figure 6 、 Figure 7 、 Figure 8 and Figure 15, including cleaning tank 1, cleaning tank 1 outer rotation connected to the cover plate 2, cleaning tank 1 on both sides of the inner wall are fixed to connect to the sliding frame 52, between the two sliding rack 52 is provided with a fixed plate 3 and the fixed plate 3 sliding connection, the fixed plate 3 top is opened with multiple through grooves 4, the fixed plate 3 is equipped with a placement groove 56, multiple placement grooves 56 are distributed around multiple grooves 4 rings and communicate with the groove 4, the fixed plate 3 is equipped with multiple rings of gear 5, multiple rings of gear 5 correspond to multiple grooves 4 one by one, Multiple rings of gear 5 are connected to the fixed plate 3 by mean...

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Abstract

The invention provides a fast flushing and quick discharge tank for integrated circulation cooling and cleaning of semiconductor wafers, and relates to the technical field of semiconductor wafer cleaning. The quick-flushing and quick-discharging tank used for integrated circulation cooling and cleaning of semiconductor wafers includes a cleaning tank, a cover plate is rotatably connected to the outside of the cleaning tank, sliding frames are fixedly connected to both sides of the inner wall of the cleaning tank, and the two A fixed plate is provided between the sliding frames and is slidably connected with the fixed plate. The fast-flushing and quick-discharging groove used for the integrated circulation cooling and cleaning of the semiconductor wafer, because the first rack is arranged inside the placement groove, the second gear pushes the second gear. One rack, so that the splints fixedly connected at one end of multiple first racks can clamp and fix the wafer, which is beneficial to quickly fix multiple wafers, reduce the contact with the wafer, and avoid the blocking caused by fixing during cleaning, which affects cleaning Efficiency, at the same time, the wafer is fixed to avoid damage to the wafer caused by shaking during cleaning.

Description

Technical field [0001] The present invention relates to a semiconductor wafer processing technology, specifically for semiconductor wafer integrated circulation cooling cleaning of fast-punch fast-rushing fast grooves, belonging to the field of semiconductor wafer cleaning technology. Background [0002] Semiconductor materials are the cornerstone of the modern semiconductor industry and the microelectronics industry. From a physical point of view, it refers to a type of material with electrical conductivity between conductors and insulators. There are many kinds of semiconductor materials, which can be roughly divided into three types: inorganic semiconductor crystals, organic semiconductor materials and amorphous semiconductors. At present, amorphous semiconductor materials have great application prospects in solar cells. But from the overall point of view, inorganic semiconductor crystals still dominate in semiconductor materials. [0003] Semiconductor wafer before and after...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/67H01L21/687B08B1/00B08B1/04B08B3/02B08B11/02B08B13/00
CPCY02P70/50
Inventor 周训丙陈良
Owner ZHICHENG SEMICON EQUIP TECH (KUNSHAN) CO LTD
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