Preparation method of broadband high-transmittance Al2O3/MgF2 double-layer antireflection film
An anti-reflection film and broadband technology, applied in coating, sputtering coating, metal material coating process, etc., can solve the problems affecting the optical performance of double-layer anti-reflection film, high refractive index of film, etc., and achieve average transmittance Improvement, light transmission performance improvement, and the effect of increasing transmittance
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Embodiment 1
[0016] Take Al 2 o 3 Preparation of broadband and high transmission double-layer Al by magnetron sputtering method for the target 2 o 3 / MgF 2 A thin film method comprising the steps of:
[0017] (1)O 2 Gas doping amount setting: high-purity O 2 (99.999%) as a reaction gas, with high-purity Ar 2 (99.999%) as the working gas, the total gas flow is set to 80sccm during sputtering, the O 2 / Ar 2 The gas flow ratios were set to 5% to allow the gases to mix well in the reaction chamber.
[0018] (2) Sputtering Al 2 o 3 Parameter setting: the sputtering working pressure is set to 0.5Pa; the sputtering power is set to 50W.
[0019] (3) Sputtering MgF 2 Parameter setting: with high-purity Ar 2 (99.999%) as working gas, high purity SF 6 (99.999%) as the reaction gas, the total gas flow rate during sputtering is set to 60 sccm, the SF 6 / Ar 2 The gas flow ratio is set to 0.5%, the sputtering working pressure is 0.1Pa; the sputtering power is set to 30W.
Embodiment 2
[0021] Take Al 2 o 3 Preparation of broadband and high transmission double-layer Al by magnetron sputtering method for the target 2 o 3 / MgF 2 A thin film method comprising the steps of:
[0022] (1)O 2 Gas doping amount setting: high-purity O 2 (99.999%) as a reaction gas, with high-purity Ar 2 (99.999%) as the working gas, the total gas flow is set to 80sccm, O 2 / Ar 2 The gas flow ratios were set to 10% so that the gases were well mixed in the reaction chamber.
[0023] (2) Sputtering Al 2 o 3 Parameter setting: the sputtering working pressure is set to 1.0Pa; the sputtering power is set to 115W.
[0024] (3) Sputtering MgF 2 Parameter setting: with high-purity Ar 2 (99.999%) as working gas, high purity SF 6(99.999%) as the reaction gas, the total gas flow rate during sputtering is set to 60 sccm, the SF 6 / Ar 2 The gas flow ratio is set to 1%, the sputtering working pressure is 0.5Pa; the sputtering power is set to 60W.
Embodiment 3
[0026] Take Al 2 o 3 Preparation of broadband and high transmission double-layer Al by magnetron sputtering method for the target 2 o 3 / MgF 2 A thin film method comprising the steps of:
[0027] (1)O 2 Gas doping amount setting: high-purity O 2 (99.999%) as a reaction gas, with high-purity Ar 2 (99.999%) as the working gas, the total gas flow is set to 80sccm, O 2 / Ar 2 The gas flow ratios were set to 15% to allow the gases to mix well in the reaction chamber.
[0028] (2) Sputtering Al 2 o 3 Parameter setting: the sputtering working pressure is set to 1.5Pa; the sputtering power is set to 150W.
[0029] (3) Sputtering MgF 2 Parameter setting: with high-purity Ar 2 (99.999%) as working gas, high purity SF 6 (99.999%) as the reaction gas, the total gas flow rate during sputtering is set to 60 sccm, the SF 6 / Ar 2 The gas flow ratio is set to 2%, the sputtering working pressure is 1.5Pa; the sputtering power is set to 120W.
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