Elastic sheet type wafer in-situ detection device and detection method

Abstract

The invention discloses an elastic piece type wafer in-place detection device and method, the elastic piece type wafer in-place detection device comprises a fixed seat, a swing piece and a sensor, the fixed seat is arranged along the circumferential direction of a bracket of a wafer exchange device, one end of the swing piece is rotatably connected to the fixed seat through a rod piece, and the other end of the swing piece is rotatably connected to the sensor. A sensing block is arranged at the other end of the swinging piece, and the sensor is arranged in the bracket; the swing piece can swing around the rod piece, so that the relative position of the induction block and the sensor is changed, and whether the wafer is in place or not is judged according to the position change of the induction block and the sensor.

Description

technical field [0001] The invention belongs to the technical field of chemical mechanical polishing, and in particular relates to a shrapnel-type wafer presence detection device and detection method. Background technique [0002] The integrated circuit industry is the core of the information technology industry and plays a key role in promoting the transformation and upgrading of the manufacturing industry to digital and intelligent. A chip is the carrier of an integrated circuit, and chip manufacturing involves technological processes such as chip design, wafer manufacturing, wafer processing, electrical measurement, cutting, packaging, and testing. Among them, chemical mechanical polishing belongs to the wafer manufacturing process. Chemical Mechanical Planarization (CMP) is a globally planarized ultra-precision surface processing technology. In chemical mechanical polishing, the wafer is usually attracted to the bottom surface of the carrier head, and the side of the w...

AI Technical Summary

Problems solved by technology

For some edge-cut wafers (Trim wafer), due to the edge trimming or thinning of the wafer, the use of traditional hydraulic inspection is prone to problems such as the wafer cannot completely cover the inspection port, and false alarms are prone to occur.

[0005] For thinner wafers, due to their light weight (10g), whether it is a hydraulic or contact type, it is difficult to maintain a stable detection state only by the weight of the wafer itself, especially when the wafer is impacted by the lifting motion of the load cup. , the wafer may send bumps on the carriage increasing the frequency of false positives

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