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SIP (Session Initiation Protocol) packaged radio frequency device

A technology of radio frequency device and radio frequency chip, applied in electrical components, electric solid state devices, circuits, etc., can solve problems such as signal quality reduction, and achieve the effect of reducing volume, reducing device cost, and making production simple

Pending Publication Date: 2022-04-08
HUBEI SANJIANG SPACE XIANFENG ELECTRONICS&INFORMATION CO LTD
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

Due to the spatial transmission characteristics of electromagnetic waves, different radio frequency signals will be coupled with each other in the same chamber, resulting in a decrease in signal quality

Method used

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  • SIP (Session Initiation Protocol) packaged radio frequency device
  • SIP (Session Initiation Protocol) packaged radio frequency device
  • SIP (Session Initiation Protocol) packaged radio frequency device

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Embodiment Construction

[0028] In order to make the object, technical solution and advantages of the present invention clearer, the present invention will be further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described here are only used to explain the present invention, not to limit the present invention. In addition, the technical features involved in the various embodiments of the present invention described below can be combined with each other as long as they do not constitute a conflict with each other.

[0029] figure 1 is a schematic structural diagram of a SIP-encapsulated radio frequency device provided by an embodiment of the present invention, figure 2 is a cross-sectional view of a SIP-packaged radio frequency device provided by an embodiment of the present invention, such as figure 1 and figure 2 As shown, the radio frequency device includes a housing component 1 and a signal compone...

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Abstract

The invention discloses an SIP (Session Initiation Protocol) packaged radio frequency device, and belongs to the technical field of integrated circuit packaging. The radio frequency device comprises a shell assembly and a signal assembly. The shell assembly comprises a base plate, an annular frame and a cover plate, the base plate and the cover plate seal and fix the bottom and the top of the annular frame to form a cavity, a plurality of partition plates are inserted in the annular frame, and the two side edges of the partition plates are connected with the base plate and the cover plate respectively to divide the cavity into a plurality of signal cavities. The signal assembly comprises a plurality of radio frequency chips, an input pin and an output pin, the plurality of radio frequency chips are in one-to-one correspondence with the plurality of signal cavities, each radio frequency chip is located in the corresponding signal cavity, the input pin and the output pin are inserted in the substrate, and the input pin and the output pin are respectively conducted with each radio frequency chip through a radio frequency microstrip line. According to the SIP packaged radio frequency device provided by the embodiment of the invention, different radio frequency chips can be isolated, so that different radio frequency signals are isolated, and the signal quality is improved.

Description

technical field [0001] The invention belongs to the technical field of integrated circuit packaging, and more particularly relates to a SIP-packaged radio frequency device. Background technique [0002] With the rapid development of wireless communication technology, the communication system has gradually increased the miniaturization requirements of the RF front-end. The SiP (System In a Package) that has gradually emerged in recent years has the characteristics of small size, high integration, and comprehensive functions. Gradually come into people's field of vision. One of the advantages of SiP is that more and more functional chips can be compressed into smaller and smaller form factors, such as wearable devices or medical implants, etc., which include more functions through smaller space occupations, In effect, this enables a complete electronic system to be packaged in one package. RF SiP, just like its name, integrates multiple RF chips with multiple functions into ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L23/552H01L23/02H01L23/16H01L23/10
Inventor 陈伟佟佶瑀李美菊赵琼
Owner HUBEI SANJIANG SPACE XIANFENG ELECTRONICS&INFORMATION CO LTD
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