The invention relates to the technical field of communication and
radar, in particular to a W-band receiving and transmitting
assembly. The W-band receiving and transmitting
assembly comprises a
local oscillator power splitter board, a transmitting chain, a receiving chain and a
local oscillator chain. The W-band receiving and transmitting
assembly further comprises a single-channel receiving module, a three-channel receiving module, an up-conversion module, a power synthesis module and a frequency multiplication module. All the modules are perpendicularly connected on the
local oscillator power splitter board through
waveguide interfaces. Due to the fact that all the modules are perpendicularly connected on the local oscillator power splitter board through the
waveguide interfaces, the parasitic effect caused by packaging and
interconnection is reduced. Due to the fact that all components in the
functional module are arranged according to a three-dimensional structure and components in a
radio frequency chain are perpendicularly connected with a power supply printing circuit board through insulators, isolation between a power supply and components is increased, and
electromagnetic compatibility of the W-band receiving and transmitting assembly is improved. Meanwhile, different electronic components are installed in different cavity body
layers, all components in the same layer are arranged in a planer
hybrid integration mode, and
miniaturization, integration and high reliability of the W-band receiving and transmitting assembly are achieved.