Chip miniature heat dissipation system based on phase change liquid cooling
A heat dissipation system and liquid cooling technology, applied in electrical components, electrical solid devices, circuits, etc., can solve the problems of electronic system damage, low heat dissipation efficiency, large volume, etc., to increase the gasification area, increase the liquefaction rate, increase the Effects of Cooling Paths
Pending Publication Date: 2022-04-12
ZKICME SUZHOU MICROELECTRONICS CO LTD
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Problems solved by technology
[0003] At present, the common heat dissipation systems include air cooling and water cooling. The air cooling system is simple, but the heat dissipation efficiency is low; the water cooling system has a higher heat capacity and high conductivity of the liquid, and the heat dissipation capacity is stronger than that of the air cooling technology, but the water cooling system is complicated to manufacture and the volume Large, and has a certain degree of danger, that is, if a water leak occurs, it will cause irreversible damage to the electronic system
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[0019] The present invention will be further described below in conjunction with the embodiments shown in the accompanying drawings.
[0020] Such as Figure 1-3 As shown, the micro-chip heat dissipation system based on phase change liquid cooling includes a thermally conductive material 1 located at the bottom, a heat dissipation box 2 installed on the thermally conductive material 1, a liquid-cooled phase change material filled in the heat dissipation box 2, and a The cooling fins 3 on the cooling box body 2. The heat-conducting material 1 is heat-conducting silica gel or heat-conducting silicone grease, etc., which can well transfer the heat generated by the chip. Liquid-cooled phase-change materials are fluorocarbons or silicone coolants. The cooling fins 3 are made of materials such as aluminum plates. The heat dissipation box 2 is made of copper plate, and a plurality of grooves 21 for increasing the contact area between the liquid-cooled phase change material and the...
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The invention discloses a phase change liquid cooling-based chip miniature heat dissipation system, which comprises a heat conduction material positioned at the lowest part, a heat dissipation box body mounted on the heat conduction material, a liquid cooling phase change material filled in the heat dissipation box body, and heat dissipation fins mounted on the heat dissipation box body, the heat dissipation fins are columnar, heat dissipation air channels with inlets and outlets communicated with the interior of the heat dissipation box body are formed in the heat dissipation fins, the heat dissipation air channels comprise a plurality of up-going channels and down-going channels which are in an up-down rotation shape, and heat dissipation gap holes are formed between the adjacent up-going channels and down-going channels; and the heat dissipation gap holes are isolated from the heat dissipation air channels and are communicated with the atmosphere. And the gasification area of the phase change liquid is effectively increased in a limited volume, the cooling path of the phase change liquid is increased, the liquefaction rate is increased, and miniaturization and high efficiency of a chip heat dissipation system are facilitated.
Description
technical field [0001] The technology relates to chip cooling equipment, in particular to a micro chip cooling system based on phase change liquid cooling. Background technique [0002] With the development of electronic technology, the integration of chips is getting higher and higher, and the power consumption is getting bigger and bigger, but the chip area is getting smaller and smaller. If the large heat generated by the small area cannot be dissipated in time, it will affect the function of the chip and even the entire system. , stability, etc. cause extremely serious impacts, so the heat dissipation problem of the chip is a problem that must be solved. [0003] At present, the common heat dissipation systems include air cooling and water cooling. The air cooling system is simple, but the heat dissipation efficiency is low; the water cooling system has a higher heat capacity and high conductivity of the liquid, and the heat dissipation capacity is stronger than that of ...
Claims
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IPC IPC(8): H01L23/427
Inventor 李尧苌凤义
Owner ZKICME SUZHOU MICROELECTRONICS CO LTD