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IGBT (Insulated Gate Bipolar Translator) module packaging structure capable of automatically controlling temperature

A technology of temperature control and module packaging, which is applied in the direction of electrical components, electric solid devices, circuits, etc., can solve problems such as heat dissipation bottlenecks, achieve the effects of solving heat dissipation bottlenecks, improving reliability and service life, and realizing precise control and rapid cooling

Active Publication Date: 2022-04-12
合肥阿基米德电子科技有限公司
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The purpose of the present invention is to provide an automatic temperature control IGBT module packaging structure to solve the heat dissipation bottleneck problem of the IGBT module TIM in the prior art, and at the same time realize precise control of chip temperature and rapid cooling

Method used

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  • IGBT (Insulated Gate Bipolar Translator) module packaging structure capable of automatically controlling temperature
  • IGBT (Insulated Gate Bipolar Translator) module packaging structure capable of automatically controlling temperature
  • IGBT (Insulated Gate Bipolar Translator) module packaging structure capable of automatically controlling temperature

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Embodiment Construction

[0024] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some of the embodiments of the present invention, not all of them. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

[0025] The object of the present invention is to provide an automatic temperature control IGBT module packaging structure, which is used to solve the heat dissipation bottleneck problem of the IGBT module TIM in the prior art, and simultaneously realize precise control of chip temperature and rapid cooling.

[0026] In order to make the above objects, features and advantages of the present invention more comprehensible, the present invention will ...

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Abstract

The invention discloses an IGBT module packaging structure with automatic temperature control. The IGBT module packaging structure comprises a heat sink, a TIM, a copper substrate, a solder layer and a copper-clad ceramic substrate which are sequentially arranged from bottom to top, a diode and an IGBT (Insulated Gate Bipolar Translator) chip are also arranged on the copper-clad ceramic substrate; a micro-channel penetrates through the heat sink, the TIM, the copper substrate, the solder layer and the copper-clad ceramic substrate; and the copper-clad ceramic substrate, the copper substrate, the heat sink and the micro-channel form a solid-liquid-gas three-phase heat dissipation system. The performance of an IGBT module heat dissipation system can be greatly improved, a liquid pump does not need to be additionally arranged, the TIM heat dissipation bottleneck problem of an IGBT module in the prior art can be solved, meanwhile, chip temperature accurate control and rapid cooling are achieved, and therefore the reliability of a device is improved, and the service life of the device is prolonged.

Description

technical field [0001] The invention relates to the technical field of power electronic chip manufacturing and packaging and testing, in particular to an automatic temperature-controlled IGBT module packaging structure. Background technique [0002] As one of the core devices for energy conversion and transmission, high-power IGBT devices are widely used in traction, electric vehicles, power transmission, etc. The further concentration of heat, the use of conventional heat conduction technology has been unable to achieve effective heat transfer, and the heat generated by dissipation seriously threatens the operational reliability of electronic equipment. [0003] Thermal management of power electronic devices refers to achieving high heat dissipation performance of devices through efficient heat dissipation technology and reasonable structural design. The stacked structure of IGBT devices is relatively complex, the thermal resistance chain is long, and the heat dissipation ...

Claims

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Application Information

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IPC IPC(8): H01L23/46H01L23/427H01L25/18
Inventor 周洋孙亚萌马坤宋一凡
Owner 合肥阿基米德电子科技有限公司
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