Gallium arsenide single crystal mechanical polishing equipment

Abstract

The invention discloses gallium arsenide single crystal mechanical polishing equipment in the technical field of wafer polishing, which comprises a supporting mechanism and is characterized by further comprising a polishing mechanism, a switching mechanism and a clamping hand, the clamping hand is installed at the upper end of the supporting mechanism in a sliding mode, the grinding mechanism is installed in the middle of the supporting mechanism, and the switching mechanism is fixedly installed on the supporting mechanism and communicates with the grinding mechanism and the clamping hand. And on the premise of ensuring that the wafer can be normally processed, the probability that the wafer is damaged by clamping force in the processing process is prevented to the greatest extent.

Description

technical field [0001] The invention relates to the technical field of wafer grinding, in particular to a gallium arsenide single crystal mechanical polishing equipment. Background technique [0002] Gallium arsenide wafers are made of gallium arsenide single crystal materials synthesized and grown from pure arsenic and gallium after cutting, grinding, polishing and cleaning. Among them, the polishing process is to achieve ultra-high precision The key process of surface requirements. At present, the polishing process of gallium arsenide wafers widely used at home and abroad is the chemical mechanical polishing (CMP) process; the chemical mechanical polishing machine is mainly composed of three parts: a wafer holder, a workbench carrying a polishing pad, and a polishing liquid supply device. During chemical mechanical polishing, the wafer holder with the wafer to be polished is pressed against the rotating polishing pad with a certain pressure, and the oxidizing polishing li...

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Problems solved by technology

[0005] The purpose of the present invention is to provide a gallium arsenide single crystal mechanical polishing equipment to solve the problem that the existing wafer holder cannot be used for wafers with different radii under the premise of ensuring normal processing. To clamp wafers with different radii with the most suitable force, because the wafer is very fragile, when the clamping force is large, it is easy to damage the wafer, and the wafers with different radii are subject to different torsional forces. When the clamping force is small, the wafer Rotation will occur again, which will affect the processing accuracy; the range of the wafer holder for wafers with different radii is limited, and it cannot provide a better protection effect on the wafer

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