Substrate bonding method and substrate
A substrate and bonding technology, which is applied in the direction of electrical components, semiconductor/solid-state device manufacturing, circuits, etc., can solve the problems of height reduction, increased workload, and low work efficiency, so as to reduce friction, improve yield, and improve The effect of utilization
Pending Publication Date: 2022-04-15
苏州科阳半导体有限公司
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Problems solved by technology
[0007] At the same time, in the traditional bonding process, since the gasket or spacer is clamped by the jaws during the extraction process, its height will decrease after extraction; when it is used to isolate the next group of substrates to be bonded, then It is necessary to adjust the height of the gasket or spacer again, which increases the workload and reduces the work efficiency
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[0039] The present invention will be further described below in conjunction with the accompanying drawings and specific embodiments, but the protection scope of the present invention is not limited thereto.
[0040] Such as figure 1As shown, the substrate bonding method described in the present invention is applicable to the situation where the edges of two substrates to be bonded are spaced by spacers 3 . In the substrate bonding method, a first substrate 1 is provided, and the first substrate 1 has an opposite first surface 101 and a second surface 102; a second substrate 2 is provided, and the second substrate 2 has an opposite third surface 201 and a fourth surface 202, the second substrate 2 is located below the first substrate 1, the second surface 102 of the first substrate 1 is adjacent to the third surface 201 of the second substrate 2; an adhesive layer 8 is provided, the The adhesive layer 8 is coated on the second surface 102 of the first substrate 1 or the third ...
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Abstract
The invention provides a substrate bonding method and a substrate, and belongs to the technical field of semiconductors. According to the substrate bonding method, after the two substrates are aligned and before heating, pressing and bonding are conducted, the clamping jaws are opened in sequence, the gaskets at the positions of the clamping jaws are pulled away, then closing and locking are conducted till all the gaskets are pulled away, then pressing and heating are conducted, and bonding is completed. According to the substrate bonding method, the gaskets are pulled away one by one in the open state of the clamping jaws, the invalid area can be reduced, dislocation caused by pulling away of the gaskets can be avoided, and the yield is improved. And meanwhile, the height position of the gasket is not changed, so that a gasket height adjusting process in the next alignment process is omitted, and the working efficiency of bonding is improved.
Description
technical field [0001] The invention relates to the technical field of semiconductor manufacturing, in particular to a substrate bonding method and a substrate. Background technique [0002] Since the concept of solid-state imaging devices was proposed by Bell Laboratories in the United States in the late 1960s, solid-state image sensors have developed rapidly and become an important branch of sensing technology. It is an indispensable peripheral for personal computer multimedia, and also a core device in monitoring equipment. [0003] In recent years, due to the improvement of integrated circuit design technology and process level, CMOS image sensor (CMOS ImageSensor, CIS) due to its inherent features such as intra-pixel amplification, column parallel structure, high integration, single power supply and low voltage power supply, cost Features such as low cost and low technical threshold have been more widely used. At the same time, the advantages of low cost, single chip,...
Claims
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Login to View More IPC IPC(8): H01L21/67H01L21/687
Inventor 苗银成陈胜江勇殷晨辉
Owner 苏州科阳半导体有限公司