Large-angle light-emitting LED packaging structure and packaging method thereof
A technology of LED encapsulation and encapsulation method, which is applied in the direction of electrical components, circuits, semiconductor devices, etc., which can solve the problems of bad taste in light-emitting colors of backlight products and affect the visual effect of backlight products, so as to increase the light emitted from the side and reduce the light emitted from the forward direction Intensity, the effect of reducing the output
Pending Publication Date: 2022-04-15
FUJIAN TIANDIAN OPTOELECTRONICS CO LTD
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Problems solved by technology
When this light source is used as a light source for Mini LED backlight products, the single-point focus is too bright, forming a checkerboard-like single-point graininess on the light-emitting surface of the backlight product, which affects the overall visual effect of the backlight product, and the light-emitting color of the backlight product is poor.
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[0042]In order to make the purpose, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments It is a part of embodiments of the present invention, but not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without creative efforts fall within the protection scope of the present invention.
[0043] In the description of the present invention, it should be noted that the terms "center", "longitudinal", "transverse", "upper", "lower", "front", "rear", "left", "right", " The orientations or positional relationships indicated by "vertical", "horizontal", "top", "bottom", "inner" and "outer" are based on the orientations or positional relat...
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Abstract
The invention provides an LED packaging structure capable of emitting light at a large angle and a packaging method of the LED packaging structure. The LED packaging structure comprises a substrate, an LED light-emitting chip, a packaging resin layer and a dimming film layer. The LED light-emitting chip is arranged on the substrate and electrically connected with the substrate. The packaging resin layer is arranged on the substrate and wraps the LED light-emitting chip. The dimming film layer is arranged above the packaging resin layer and covers the top or the upper surface of the substrate. And the dimming film layer is prepared by mixing silica gel and titanium dioxide according to a certain proportion. Therefore, the LED packaging structure can increase the light-emitting angle (close to 180 degrees or larger) of the LED light-emitting chip, meanwhile, the intensity of central light is adjusted in time, and focuses or dazzling light are reduced.
Description
technical field [0001] The invention relates to the technical field of semiconductor packaging, in particular to an LED packaging structure capable of having a large divergence angle and a packaging method thereof. Background technique [0002] LED (also known as light-emitting diode, chip, chip, etc.) has the advantages of long service life, low power consumption, small size, high reliability, and good environmental protection. Its application field and scope of use are constantly expanding and expanding. LEDs have become the first source of various light sources in different fields, such as light sources for backlight units, light sources for general lighting or lighting, light sources for city night lights, etc. [0003] In the existing LED backlight lighting products, how to convert point light sources into uniform surface light sources is one of the research hotspots of backlight LED products. Such as figure 1 As shown, the luminous angle a' (also known as the power a...
Claims
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Login to View More IPC IPC(8): H01L33/58H01L33/60H01L33/48
Inventor 吴奕备林艺铃黄明少熊毅洪国展杨皓宇陈锦庆林紘洋李昇哲万喜红
Owner FUJIAN TIANDIAN OPTOELECTRONICS CO LTD