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COB (Chip On Board) lamp strip board directly packaged on wire and manufacturing method thereof

A manufacturing method and technology of light strips, which are applied in the fields of printed circuit manufacturing, cleaning/polishing of conductive patterns, formation of conductive patterns, etc., can solve problems such as cumbersome procedures and affect the processing efficiency of light strips, and achieve simplified process procedures and easy large-scale Scale promotion, the effect of improving the bonding quality

Inactive Publication Date: 2022-04-22
江门市尚仕达电子有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] However, during the processing of the light strip board in the above technology, it is necessary to process a bracket for installing the lamp beads on the light strip board, and the process is relatively cumbersome, which affects the processing efficiency of the light strip board

Method used

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  • COB (Chip On Board) lamp strip board directly packaged on wire and manufacturing method thereof
  • COB (Chip On Board) lamp strip board directly packaged on wire and manufacturing method thereof
  • COB (Chip On Board) lamp strip board directly packaged on wire and manufacturing method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0042] see Figure 3-Figure 5 As shown, the cleaning device described in the embodiment of the present invention includes a support frame 4, the bottom end of the support frame 4 is provided with a bottom plate 5, the top surface of the bottom plate 5 is fixedly connected with a support plate 6, and the top of the support plate 6 is A push rod 7 is installed on the support frame 4, the bottom end of the push rod 7 is connected with a pressing plate 8, a motor 9 is installed at the top of the support frame 4, and the end of the motor 9 is connected with a take-up roller 10 through a rotating shaft. The support frame 4 corresponding to the bottom end of the take-up roller 10 is rotatably connected with a guide wheel 11; It is connected to the side wall of the take-up roller 10, and then the push rod 7 drives the pressure plate 8 to be pressed on the surface of the base layer 1. When the motor 9 works and drives the take-up roller 10 to roll the base layer 1, the base layer 1 wil...

Embodiment 2

[0050] Such as Figure 6As shown in Comparative Example 1, another embodiment of the present invention is: the inner wall of the inner end of the turn slot is inlaid with a magnetic plate 31 capable of attracting the adsorption block 29, and the support net 27 is Between the free ends of the symmetrical two telescopic capsules 28, there is a pressure member 32 connected by a connecting rod, and the inner wall of the support net 27 between the symmetrical two telescopic capsules 28 is connected with a blocking capsule 33, and the blocking capsule 33 is provided with a plurality of Vent chamber 34; the vent chamber 34 provided on the blocking bag 33 can effectively communicate the through groove 26 with the outside world. When the rotating column 22 drives the telescoping bag 28 to move to the magnetic plate 31, the magnetic plate 31 attracts the adsorption block 29 The connecting rod can drive the pressing piece 32 to squeeze the sealing bag 33, so that the sealing bag 33 close...

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Abstract

The invention belongs to the technical field of COB, and particularly relates to a COB lamp strip board directly packaged on a wire and a manufacturing method thereof.The COB lamp strip board comprises a base layer made of a PI film material, copper wires are arranged and attached to the top face of the base layer, an electroplated layer capable of wiring is arranged on the copper wires or the surface of the copper wires, and the adjacent copper wires are sequentially crossed and broken; a PI white film or printing ink is attached to the bottom face of the base layer. According to the COB flip chip packaging structure, the COB flip chip packaging effect is achieved in the mode that the copper wire on the base layer is broken, the LED flip chip is pasted in the forward direction and the reverse direction to form a circuit, meanwhile, the electroplated layer on the copper wire can be a silver-plated layer or a tin-plated layer, and due to the weldability of the electroplated layer, the silver-plated wire or the tin-plated wire can achieve the wiring function and has the light reflection function. A lamp bead support is not needed, and the lamp bead can be directly used in the later period to achieve the flip-chip packaging effect; therefore, the COB lamp strip board is simpler in processing flow, lower in cost and easier to popularize on a large scale, the original process is simplified, and more cost is saved.

Description

technical field [0001] The invention belongs to the technical field of COB, and in particular relates to a COB light strip board directly packaged on wires and a manufacturing method thereof. Background technique [0002] Due to the advantages of high luminous efficiency and light and thin products, COB light strips are increasingly widely used. The production of COB light strips is to directly package the chip on the flexible circuit board. However, limited by the process, the length of a single flexible circuit board is generally 0.5 meters or 1 meter. Therefore, in order to obtain a COB light strip with a desired length, such as a 5-meter or 10-meter COB light strip, it is necessary to sequentially connect multiple flexible circuit boards in the length direction. [0003] A Chinese patent with the publication number CN102709444B discloses an LED light strip module that directly forms an LED bracket on the wire, including: a metal wire; an insulating bracket integrated w...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K1/02H05K3/10H05K3/00H05K3/26H05K3/30
CPCH05K1/02H05K1/0296H05K3/103H05K3/0044H05K3/26H05K3/30
Inventor 谢祥信
Owner 江门市尚仕达电子有限公司