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High-temperature-resistant polyimide structure cementing agent and application thereof

A technology of polyimide and cement, applied in the direction of adhesives, etc., can solve the problems of bonding interface defects, easy deterioration of bonding performance, failure, etc.

Active Publication Date: 2022-04-26
INST OF CHEM CHINESE ACAD OF SCI
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, since this type of thermosetting binder requires the use of high-boiling polar aprotic organic solvents such as N-methylpyrrolidone, N,N-dimethylformamide or N,N-dimethylacetamide, these solvents are used in It is difficult to completely remove the resin cross-linking and curing, which often leads to the formation of defects in the bonding interface, and the bonding performance is easy to deteriorate or even fail during long-term use. It is difficult to meet the needs of aerospace for higher heat-resistant adhesives

Method used

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  • High-temperature-resistant polyimide structure cementing agent and application thereof

Examples

Experimental program
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Effect test

Embodiment 1

[0030] In a three-necked flask equipped with mechanical stirring, a thermometer and a nitrogen inlet and outlet, add 68.32 grams (0.15 moles) of 4,4'-(hexafluoroisopropene) diphthalic dianhydride (6FDA) and 91.76 grams of ethanol (1.99 moles ), heated to reflux under nitrogen protection, cooled to room temperature after reacting for 48 to obtain 6FDA diacid diester solution. In a three-necked flask equipped with mechanical stirring, a thermometer, and a nitrogen inlet and outlet, add 9.92 grams (0.04 moles) of 4-phenylethynylphthalic anhydride (PEPA) and 12.97 grams (0.28 moles) of ethanol, and raise the temperature to reflux under nitrogen protection. After 48 Cool to room temperature to obtain PEPA monoacid monoester solution. 13.73 grams of 2,2'-bis(trifluoromethyl)diaminobiphenyl (TFDB) and 13.57 grams of p-phenylenediamine (PDA) were added to the 6FDA diacid diester solution under stirring, and 27.31 grams (0.59 moles ) ethanol solution, stirring under nitrogen protectio...

Embodiment 2

[0035]In a three-neck flask equipped with mechanical stirring, a thermometer and a nitrogen inlet and outlet, add 122.98 grams (0.28 moles) of 4,4'-(hexafluoroisopropene) diphthalic dianhydride (6FDA) and 165.06 grams of ethanol (3.59 moles ), heated to reflux under nitrogen protection, cooled to room temperature after reacting for 48 to obtain 6FDA diacid diester solution. In a three-necked flask equipped with mechanical stirring, a thermometer, and a nitrogen inlet and outlet, add 17.87 grams (0.07 moles) of 4-phenylethynylphthalic anhydride (PEPA) and 23.34 grams (moles) of ethanol, raise the temperature to reflux under nitrogen protection, react for 48 hours and then cool to room temperature to obtain a PEPA monoacid monoester solution. Add 25.04 grams of 2,2'-bis(trifluoromethyl)diaminobiphenyl (TFDB) and 25.37 grams of p-phenylenediamine (PDA) into the 6FDA diacid diester solution under stirring, add 49.16 grams (1.07 moles ) ethanol solution, stirring under nitrogen pr...

Embodiment 3

[0040] In a three-neck flask equipped with mechanical stirring, a thermometer and a nitrogen inlet and outlet, add 68.32 grams (0.15 moles) of 4,4'-(hexafluoroisopropylene) diphthalic dianhydride (6FDA) and 100.37 grams of isopropanol ( 1.67 mol), heated to reflux under nitrogen protection, reacted for 48 hours and cooled to room temperature to obtain 6FDA diacid diester solution. In a three-necked flask equipped with mechanical stirring, a thermometer and a nitrogen inlet and outlet, add 9.92 grams (0.04 moles) of 4-phenylethynylphthalic anhydride (PEPA) and 14.10 grams (0.23 moles) of isopropanol, and raise the temperature to reflux under nitrogen protection, and react After 48 hours, it was cooled to room temperature to obtain a PEPA monoacid monoester solution. Add 13.73 grams of 2,2'-bis(trifluoromethyl)diaminobiphenyl (TFDB) and 13.57 grams of p-phenylenediamine (PDA) into the 6FDA diacid diester solution under stirring, add 27.31 grams (0.45 moles ) ethanol solution, s...

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Abstract

The invention discloses a high-temperature-resistant polyimide structure cementing agent and application thereof. The high-temperature-resistant polyimide structure cementing agent is formed by mixing a polyamic acid ester solution A and a polyamic acid ester solution B, the mass ratio of the polyamide acid ester A solution to the polyamide acid ester B solution is (50-100): (0-50), and the mass of the polyamide acid ester B solution is not zero; the solid content of the high-temperature-resistant polyimide structure cementing agent is 25-85%, and the viscosity of the high-temperature-resistant polyimide structure cementing agent at the room temperature is 3000-100000 mPa.s. The polyimide structural cementing agent provided by the invention can be used for bonding a carbon fiber composite material component, a glass fiber composite material component, a non-metal material component or a metal material component; the polyimide structural adhesive is coated on the surface of a to-be-adhered structural member, an adhesive layer is formed on the to-be-treated surface after heating treatment, then another to-be-adhered structural member is laminated, and adhesion is carried out at the temperature of 20-380 DEG C and the pressure of 0.5-15 MPa. The polyimide cementing agent can be applied to structural bonding of high-temperature-resistant parts in the fields of aerospace, petrochemical engineering and the like.

Description

technical field [0001] The invention relates to a high-temperature-resistant polyimide structural cement and its application, belonging to the technical field of material preparation. Background technique [0002] With the development of aerospace vehicle manufacturing technology, a large number of aerospace vehicles use carbon fiber or quartz fiber reinforced resin matrix composite components to replace traditional metal components to reduce structural weight, and composite components require adhesives to achieve structural bonding. Composite structural adhesives include epoxy resin adhesives, polyurethane adhesives, polyacrylate adhesives, silicone resin adhesives, double horse resin adhesives and polyimide adhesives, among which Polyimide adhesives have the highest heat resistance. [0003] Polyimide binder has excellent high temperature resistance and comprehensive mechanical properties. It can be used not only for bonding carbon fiber reinforced polyimide composite mat...

Claims

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Application Information

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IPC IPC(8): C09J179/08C08G73/10C08G73/12
CPCC09J179/085C08G73/1067C08G73/1007C08G73/1014C08G73/12C08L2205/025C08L79/085
Inventor 杨士勇张浩洋袁莉莉
Owner INST OF CHEM CHINESE ACAD OF SCI
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