Multi-section slicing machine for monocrystalline silicon processing

Abstract

The invention relates to the technical field of monocrystalline silicon slicing, in particular to a multi-section slicing machine for monocrystalline silicon processing, which comprises a fixing frame, a mounting mechanism is mounted on the fixing frame, a spraying mechanism is mounted on the fixing frame, a filtering mechanism is mounted on the spraying mechanism, an abutting mechanism is mounted on the mounting mechanism, and an abutting mechanism is mounted on the abutting mechanism. A collecting mechanism is mounted in the mounting mechanism, and a pollution discharge mechanism is mounted on the collecting mechanism; the mounting mechanism and the abutting mechanism facilitate good placement and slicing work of monocrystalline silicon with different lengths, the spraying mechanism and the filtering mechanism work, better cutting of the monocrystalline silicon is facilitated, abrasion of equipment is reduced, impurities in water can be filtered, and the service life of the equipment is prolonged. And by means of the importance of the collecting mechanism and the sewage discharging mechanism, the cut silicon wafers can be collected and placed, abrasion caused by falling of the silicon wafers is reduced, and meanwhile sewage can be conveniently recycled and stored.

Description

technical field [0001] The invention relates to the technical field of monocrystalline silicon slicing, in particular to a multi-segment slicing machine for monocrystalline silicon processing. Background technique [0002] Monocrystalline silicon is a relatively active non-metallic element and an important part of crystalline materials. It is at the forefront of the development of new materials. Its main uses are as semiconductor materials and the use of solar photovoltaic power generation and heating. During the processing and production of crystalline silicon, it is necessary to cut large-volume monocrystalline silicon rods into pieces, so as to facilitate subsequent production. [0003] However, the existing patent number: 201920357369.6 is a monocrystalline silicon rod slicing device, which can perform multi-segment slicing work on single crystal silicon rods. Cutting equipment is worn out, which reduces the service life. At the same time, if the cut silicon wafers are ...

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Problems solved by technology

[0003] However, the existing patent number: 201920357369.6 is a monocrystalline silicon rod slicing device, which can perform multi-segment slicing work on single crystal silicon rods. The cutting equipment is worn out, which reduces the service life. At the same time, if the cut silicon wafers are directly dropped and collected, it is easy to cause the silicon wafers to collide and break, which is not conducive to subsequent production and use.

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