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Water-jet guided laser system and double-layer material cutting method

A technology of laser system and cutting method, applied in laser welding equipment, metal processing equipment, welding equipment, etc., can solve the problems of blockage of small holes, inability to cut coated materials, burnt materials, etc.

Pending Publication Date: 2022-05-03
上海赛卡精密机械有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Among them, EDM has a relatively obvious thermal effect, and it is impossible to cut the coated material. The material needs to be cut and then coated, but the diameter of the air film hole is very small, and it is easy to coat the cut after cutting. Pore ​​clogging or changing the size of the small hole
[0004] Femtosecond / picosecond lasers can directly process coated materials, but there are obvious cone angles and recast layers. After the laser penetrates the cutting layer, it will directly irradiate another layer of material, thus burning another layer of material

Method used

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  • Water-jet guided laser system and double-layer material cutting method
  • Water-jet guided laser system and double-layer material cutting method

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Embodiment Construction

[0027] Preferred embodiments of the present invention will be described in detail below with reference to the accompanying drawings, so as to better understand the purpose, features and advantages of the present invention. It should be understood that the embodiments shown in the drawings are not intended to limit the scope of the present invention, but only to illustrate the essence of the technical solutions of the present invention.

[0028] In the following description, for the purposes of explaining the various disclosed embodiments, certain specific details are set forth in order to provide a thorough understanding of the various disclosed embodiments. One skilled in the relevant art will recognize, however, that an embodiment may be practiced without one or more of these specific details. In other instances, well-known devices, structures and techniques associated with the present application may not have been shown or described in detail in order to avoid unnecessarily...

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PUM

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Abstract

The invention discloses a water-jet guided laser system and a double-layer material cutting method, and the water-jet guided laser system comprises a bubble generator which can generate micro-nano bubbles. When the water-guided laser equipment cuts or punches one layer of the double-layer material, a gap between the double-layer material is filled with micro-nano bubbles generated by the bubble generator, multiple beams of gathered laser penetrate through one layer to the gap and then are scattered or refracted by a large number of micro-nano bubbles, and divergent energy-weakened laser is formed. Therefore, the other layer of material is protected from being burnt.

Description

technical field [0001] The invention relates to the technical field of cutting, in particular to a water-conducting laser system and a double-layer material cutting method. Background technique [0002] Cutting is a way of industrial equipment processing, and it is widely used. When cutting one layer of some double-layer materials with gaps, it is necessary to protect the other layer from damage, such as air film hole processing of aircraft blades. Aircraft blades are There are two layers of material and there is a gap between the two layers of material, and there is a coating on the surface of the aircraft blade. When cutting the aircraft blade, the process requirement is to complete one layer of cutting with high efficiency, but not to damage the other layer of material. [0003] In the prior art, common precision cutting methods include EDM, femtosecond laser or picosecond laser, and water-guided laser. Among them, EDM has a relatively obvious thermal effect, and it is i...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23K26/38B23K26/14B23K26/146
CPCB23K26/38B23K26/14B23K26/146
Inventor 杨锐俊顾大雄宋志嘉邓弢
Owner 上海赛卡精密机械有限公司
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