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Display substrate, preparation method thereof and display device

A display substrate and display area technology, applied in semiconductor/solid-state device manufacturing, semiconductor devices, electrical components, etc., can solve the problems of organic packaging materials such as climbing, reduce the risk of overflow, avoid GDS failure, and improve flatness and the effect of the encapsulation effect

Pending Publication Date: 2022-05-03
BOE TECH GRP CO LTD +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] Embodiments of the present disclosure provide a display substrate and its preparation method, and a display device, which can solve the problem of organic packaging materials climbing at the barrier dam

Method used

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  • Display substrate, preparation method thereof and display device
  • Display substrate, preparation method thereof and display device
  • Display substrate, preparation method thereof and display device

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Embodiment Construction

[0036] Embodiments of the present invention will be described in detail below in conjunction with the accompanying drawings. Note that an embodiment may be embodied in many different forms. Those skilled in the art can easily understand the fact that the means and contents can be changed into various forms without departing from the gist and scope of the present disclosure. Therefore, the present disclosure should not be interpreted as being limited only to the contents described in the following embodiments. In the case of no conflict, the embodiments in the present disclosure and the features in the embodiments can be combined arbitrarily with each other.

[0037] In the drawings, the size of each component, the thickness of a layer, or a region is sometimes exaggerated for the sake of clarity. Therefore, one aspect of the present disclosure is not necessarily limited to the dimensions, and the shapes and sizes of components in the drawings do not reflect actual scales. I...

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PUM

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Abstract

The invention discloses a display substrate, a preparation method thereof and a display device. The display substrate comprises a display area and a peripheral area located on the periphery of the display area, and the peripheral area is provided with a blocking dam and at least one blocking column. The display substrate comprises a substrate body, a light-emitting structure layer and a packaging structure layer, the light-emitting structure layer and the packaging structure layer are arranged on the substrate body, the packaging structure layer is located on the side, away from the substrate body, of the light-emitting structure layer, the light-emitting structure layer comprises a cathode, the packaging structure layer comprises an organic packaging layer, and at least one blocking column is located between the cathode and a blocking dam. The orthographic projection of the at least one blocking column on the substrate is located in the range of the orthographic projection of the organic packaging layer on the substrate.

Description

technical field [0001] Embodiments of the present disclosure relate to the field of display technology, and in particular, to a display substrate, a manufacturing method thereof, and a display device. Background technique [0002] Flexible OLED (Organic Light-Emitting Diode, Organic Light-Emitting Diode) displays have the advantages of being foldable, bendable, and narrow borders, and are considered to have broad application prospects. OLED displays generally adopt a three-layer thin film encapsulation (Thin Film Encapsulation, TFE) structure of inorganic layer-organic layer-inorganic layer. In the TFE encapsulation layer, it is often required that the fluidity of the organic layer material is good, and the surface is flat after curing to ensure the encapsulation effect and display effect of the display. However, good fluidity is easy to cause overflow of the organic material. Oxygen capacity is weak, once overflow occurs, it will lead to packaging failure and affect the di...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L51/52H01L51/56H01L27/32
CPCH10K59/12H10K50/8428H10K50/844H10K71/00H10K59/873H10K59/00H10K50/80H10K59/122H10K2102/311
Inventor 何庆蒋志亮龙再勇陈敏王格袁晓敏燕青青潘向南
Owner BOE TECH GRP CO LTD