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Control method and device for LED and semiconductor laser chip silicon wafer conveying device

The technology of a conveying device and a control method, which is applied in the field of silicon wafer conveying devices, can solve problems such as complex structure of sorting equipment, difficult chip sorting, and small chip size, so as to promote the technical level and mass production capacity, and improve the technical level and mass production capacity, the effect of compact and reasonable layout

Inactive Publication Date: 2022-05-06
山东泓瑞光电科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the sorting of LED and semiconductor laser chips is very difficult, mainly because the chip size is generally very small, and the size is at the nanometer level. Such small chips need microprobes to complete the test, and the sorting process requires precise mechanical and image recognition systems. , which makes the structure of the sorting equipment very complicated, and at the same time, the cost is high, and the sorting speed is slow and the sorting efficiency is low

Method used

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  • Control method and device for LED and semiconductor laser chip silicon wafer conveying device
  • Control method and device for LED and semiconductor laser chip silicon wafer conveying device
  • Control method and device for LED and semiconductor laser chip silicon wafer conveying device

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0037] Such as figure 1 As shown, a method for controlling a silicon wafer delivery device for LED and semiconductor laser chips, including the initial step, the control step of the lifting table, the step of sending out silicon wafers and the step of retrieving empty silicon wafers, can quickly complete the sorting machine for LED and semiconductor laser chips silicon wafer delivery task.

[0038] Initial steps:

[0039] Such as figure 1 As shown, the silicon wafer box 90 loaded with silicon wafers is manually placed on the lifting platform 100. No silicon wafer is placed in the silicon wafer box 90 shown in the figure. The silicon wafer is a disc-shaped structure, and the disc film carries There are LED or semiconductor laser chips to be sorted, and then the equipment is powered on, and all components are in the initial position.

[0040] Lift control steps:

[0041] Such as figure 1 , image 3 , Figure 4 with Figure 5 Commonly shown, when the wafer cassette 90 is ...

Embodiment 2

[0068] Such as figure 1 with figure 2 Commonly shown, an LED and semiconductor laser chip silicon wafer conveying device for realizing the control method of the LED and semiconductor laser chip silicon wafer conveying device described in Embodiment 1 includes a lifting platform 100 , a silicon wafer workbench 300 and a manipulator 200 .

[0069] Such as figure 1 with image 3 As shown together, the lifting platform 100 includes a bracket 110 and a power box 140 for driving the bracket 110 up and down, and silicon wafers loaded with chips to be sorted are placed on the bracket 110 through the wafer cassette 90 .

[0070] Such as image 3 As shown, the bracket 110 includes a bottom plate 112 , a first side plate 114 and a second side plate 116 are vertically provided on the left and right sides of the bottom plate 112 , and a fourth side plate 118 is vertically provided on the front side. The opposite sides of the first side plate 114 and the second side plate 116 are fixed...

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Abstract

The invention discloses a control method and device for an LED and semiconductor laser chip silicon wafer conveying device, and relates to the technical field of mechanical equipment control, and the control method comprises a silicon wafer sending-out step and an empty silicon wafer taking-back step: the silicon wafer sending-out step comprises the following steps: S11, grabbing a silicon wafer from a lifting platform by a manipulator, and carrying out loading preparation on a silicon wafer workbench; s12, the manipulator drags the silicon wafer and moves the silicon wafer to a position above the silicon wafer workbench; s13, the manipulator places the silicon wafer on the silicon wafer workbench; s14, loading the silicon wafer on the silicon wafer workbench; the silicon wafer taking-back step comprises the following steps that S21, an empty silicon wafer is unloaded from the silicon wafer workbench, and the manipulator grabs the empty silicon wafer from the silicon wafer workbench; s22, the manipulator drags the empty silicon wafer to move to the lifting platform; and S23, the manipulator sends the empty silicon wafer back to the lifting platform. And the conveying task of the silicon wafers can be quickly completed.

Description

technical field [0001] The invention relates to the technical field of mechanical equipment control, in particular to a silicon chip conveying device control method and a silicon chip conveying device used for LED and semiconductor laser chip sorting machines. Background technique [0002] The scale of the LED and semiconductor laser industry is developing very rapidly, and the market potential is huge, but its development cannot be separated from the development of the LED and semiconductor laser equipment industry for support. The LED and semiconductor laser industry has its particularity. Due to the production process, each LED and semiconductor laser chip is unique, with slightly different electronic and optical characteristics. This requires all LED and semiconductor laser chips to be unique. Laser chips are tested and sorted for their unique characteristics. However, the sorting of LED and semiconductor laser chips is very difficult, mainly because the chip size is ge...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B07C5/00
CPCB07C5/00B07C2501/0063
Inventor 陈国强刘江涛董月宁
Owner 山东泓瑞光电科技有限公司
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