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Bluetooth earphone mainboard with noise reduction structure and capable of shielding noise

A Bluetooth headset and motherboard technology, applied in earphone/headphone accessories, earphones to reduce environmental noise, cooling/ventilation/heating transformation, etc., can solve the problem that the effect of noise reduction cannot meet the requirements, affect the operating efficiency of the motherboard, and the heat dissipation effect is poor. and other problems, to achieve the effect of solving the poor signal of GPS antenna, reducing noise and prolonging service life

Pending Publication Date: 2022-05-06
深圳市美师傅科技有限公司
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The common problems of the existing bluetooth headset mainboard are: when the existing bluetooth headset mainboard is working, due to the interference of various noises in the external environment, it will cause interference to the sound that needs to be received, which will lead to noise reduction. The role of the problem can not meet the requirements, and there are also disadvantages of poor heat dissipation effect affecting the operating efficiency of the motherboard, and the applicability is not strong

Method used

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  • Bluetooth earphone mainboard with noise reduction structure and capable of shielding noise
  • Bluetooth earphone mainboard with noise reduction structure and capable of shielding noise
  • Bluetooth earphone mainboard with noise reduction structure and capable of shielding noise

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Embodiment Construction

[0028] see Figure 1-3 , the present invention provides a technical solution: a bluetooth earphone motherboard with a noise reduction structure capable of shielding noise, including a motherboard body 1 and a low-noise heat dissipation mechanism 7, a heat dissipation roller 6 is arranged transversely across the front of the motherboard body 1, and the low-noise heat dissipation mechanism 7 is installed in the middle of the front of the heat dissipation roller 6. The low-noise heat dissipation mechanism 7 includes a heat conduction plate 701, an air duct 702, a heat dissipation surface 703, a bearing 704, a rubber ring 705 and a horizontal plate 706, and the inside of the heat conduction plate 701 is longitudinally provided with an air duct 702, and The inner side of the top of the air duct 702 is symmetrically installed with an arc-shaped heat dissipation surface 703, the middle end of the top of the air duct 702 is rotatably installed with a bearing 704, and the outer part of ...

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Abstract

The invention discloses a Bluetooth headset mainboard with a noise reduction structure and capable of shielding noise, and relates to the field of Bluetooth headset mainboards, the Bluetooth headset mainboard comprises a mainboard body and a low-noise heat dissipation mechanism, a heat dissipation roller is transversely arranged on the front surface of the mainboard body in a penetrating manner, and the low-noise heat dissipation mechanism is mounted in the middle of the front surface of the heat dissipation roller. The technical problems that when an existing Bluetooth headset main board works, due to interference of various kinds of noise in the external environment, sound needing to be received can be interfered, the noise reduction effect cannot meet the requirement, and meanwhile the defect that the operation efficiency of the main board is affected due to the poor heat dissipation effect exists are solved. According to the Bluetooth headset mainboard with the noise reduction structure and capable of shielding noise, the sound receiving device is independently arranged on the right side of the mainboard, the partition plate made of the copper-nickel-copper material is attached to the left side of the shell, mutual interference between the sound receiving device and other signal sources is effectively shielded, and the problems that an existing Bluetooth headset mainboard has call noise, is poor in GPS antenna signal and the like are solved.

Description

technical field [0001] The invention relates to the field of a bluetooth earphone mainboard, in particular to a bluetooth earphone mainboard with a noise reduction structure capable of shielding noise. Background technique [0002] Bluetooth headset is to apply Bluetooth technology to hands-free headsets, so that users can avoid annoying wires and talk easily in various ways. Since the Bluetooth headset came out, it has been a good tool for mobile business people to improve efficiency. The motherboard is an indispensable and important component to control the normal operation of the Bluetooth headset. [0003] The common problems of the existing bluetooth headset mainboard are: when the existing bluetooth headset mainboard is working, due to the interference of various noises in the external environment, it will cause interference to the sound that needs to be received, which will lead to noise reduction. The role of the problem does not meet the requirements, but also has ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H04R1/10H05K7/20
CPCH04R1/1083H04R1/10H05K7/20
Inventor 李果陈焜
Owner 深圳市美师傅科技有限公司
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