Bluetooth earphone mainboard with noise reduction structure and capable of shielding noise
A Bluetooth headset and motherboard technology, applied in earphone/headphone accessories, earphones to reduce environmental noise, cooling/ventilation/heating transformation, etc., can solve the problem that the effect of noise reduction cannot meet the requirements, affect the operating efficiency of the motherboard, and the heat dissipation effect is poor. and other problems, to achieve the effect of solving the poor signal of GPS antenna, reducing noise and prolonging service life
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[0028] see Figure 1-3 , the present invention provides a technical solution: a bluetooth earphone motherboard with a noise reduction structure capable of shielding noise, including a motherboard body 1 and a low-noise heat dissipation mechanism 7, a heat dissipation roller 6 is arranged transversely across the front of the motherboard body 1, and the low-noise heat dissipation mechanism 7 is installed in the middle of the front of the heat dissipation roller 6. The low-noise heat dissipation mechanism 7 includes a heat conduction plate 701, an air duct 702, a heat dissipation surface 703, a bearing 704, a rubber ring 705 and a horizontal plate 706, and the inside of the heat conduction plate 701 is longitudinally provided with an air duct 702, and The inner side of the top of the air duct 702 is symmetrically installed with an arc-shaped heat dissipation surface 703, the middle end of the top of the air duct 702 is rotatably installed with a bearing 704, and the outer part of ...
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