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Assembly process for intelligent audio module production

An assembly process and audio technology, applied in the direction of manufacturing tools, metal processing, auxiliary devices, etc., can solve the problems of reducing production efficiency, prolonging the process flow, increasing the workload of production personnel and production time, etc., to improve production efficiency and shorten the process. process, the effect of reducing product surface damage

Pending Publication Date: 2022-05-10
惠州市则成技术有限公司
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] Regarding the related technologies mentioned above, the inventor believes that the production process of the prior art prolongs the process flow, increases the workload and production time of production personnel, and reduces production efficiency

Method used

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  • Assembly process for intelligent audio module production
  • Assembly process for intelligent audio module production
  • Assembly process for intelligent audio module production

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Embodiment Construction

[0043] The following is attached Figure 1-3 The application is described in further detail.

[0044] The embodiment of the present application discloses an assembly process for producing an intelligent audio module. refer to figure 1 , an assembly process for the production of an intelligent audio module, comprising the following steps:

[0045] S1. First use adhesive tape to plug the holes of the components to be welded;

[0046] S2, fixing the components and the FPC with the plug holes completed using the welding jig 1;

[0047] S3. Put the welding jig 1 that has fixed the components and the FPC on the automatic welding device 3 and fix it;

[0048] S4. Start the auxiliary positioning component 4 to assist in positioning the components and the characteristic parts of the FPC;

[0049] S5. Start the automatic welding device 3 to automatically weld the components and the FPC.

[0050] By plugging the components, the holes of the components can be protected, the componen...

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Abstract

The invention relates to the technical field of electronic component processing, in particular to an assembly process for intelligent audio module production, which can protect a hole of a component by plugging the hole of the component and fix the plugged component and an FPC (Flexible Printed Circuit) by using a welding jig. Then the welding jig is placed at an automatic welding device to be fixed, the auxiliary positioning assembly is started to conduct auxiliary positioning on the characteristic parts of the component and the FPC so as to improve the placement stability of the component and the FPC and reduce floating height, finally, the automatic welding device is started to conduct automatic welding operation, manual welding of personnel intervention is omitted, and the beneficial effects that the technological process is shortened, and the production efficiency is improved are achieved. The production efficiency is improved, and the production time is shortened.

Description

technical field [0001] The invention relates to the technical field of electronic component processing, in particular to an assembly process for producing an intelligent audio module. Background technique [0002] Flexible Printed Circuit (FPC) is a highly reliable and excellent flexible printed circuit board made of polyimide or polyester film as the base material. It has the characteristics of high wiring density, light weight, thin thickness and good bendability. [0003] FPC boards are widely used and are also a very commonly used material in the electronics industry today. In the processing of electronic components, FPC and components will be used for welding to form an audio component FPCBA. Specifically, when producing FPCBA, there will be high quality problems between components and FPC. Floating height often affects the reliability of product functions. [0004] And in the prior art, to the problem of floating height, be to adopt the method for manual welding in ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23K31/02B23K37/02B23K37/04
CPCB23K31/02B23K37/04B23K37/0247B23K2101/42
Inventor 谢代忠朱利平
Owner 惠州市则成技术有限公司
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