Full-automatic multifunctional IGBT packaging machine

Abstract

The invention discloses a full-automatic multifunctional IGBT packaging machine which comprises a rack, a packaging mechanism, a jig disc conveying mechanism, a crystal ring feeding and jacking mechanism, a TRAY disc feeding mechanism, a component feeding mechanism and a soldering lug feeding and cutting mechanism. The soldering lug feeding and cutting mechanism is used for stretching a soldering lug roll and cutting a single soldering lug of which the length is equal to a preset soldering lug length; the packaging mechanism comprises an adsorption machine head, a machine head rotating assembly and a three-direction movement driving assembly. The IGBT packaging of the first wafer, the second wafer, the electronic component and the soldering lug can be compatible, multiple packaging devices do not need to be arranged, the overall structure is simplified, the production space is saved, and the production cost is reduced; meanwhile, full-automatic cutting of the soldering lug belt can be achieved, the manual participation degree is low, the automation degree is high, the cutting efficiency of the soldering lug is effectively improved, the single soldering lug with the fixed length can be cut according to the production requirement so as to meet different production requirements, and compatibility is high.

Description

technical field [0001] The invention relates to the field of packaging machines, in particular to a fully automatic multifunctional IGBT packaging machine. Background technique [0002] IGBT packaging equipment is a fully automatic loading and unloading and packaging equipment for products such as chips or electronic components or FEDDER materials. However, at present, domestic equipment products without this function mainly rely on foreign imports, and the use of foreign imported products is expensive, resulting in an increase in production costs. [0003] In addition, the IGBT packaging equipment imported from abroad has the following problems: 1. It is impossible to concentrate chips, electronic components, soldering pieces, etc. in the same equipment, and one equipment can only perform packaging operations for a single product, and cannot be compatible with the packaging of multiple products 2. In order to ensure the packaging accuracy, it is necessary to set up a posit...

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Problems solved by technology

[0005] The purpose of the present invention is to overcome the deficiencies of the prior art and provide a fully automatic multifunctional IGBT encapsulation machine to solve the problem that in the prior art, the same IGBT encapsulation machine cannot be compatible with the encapsulation operations of chips, electronic components, soldering pieces, etc. at the same time, resulting in The problem of high production cost; solve the problem that the overall structure of the equipment is complicated and takes up a lot of space because of the need to set a position correction mechanism; solve the problem that the automatic cutting of solder tabs cannot be realized, and the single solder tab of a specified length cannot be automatically cut; solve The problem that the automatic replacement of vacuum nozzles and syringes cannot be realized

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