Method for electroless plating of metals with different thicknesses, packaging method for devices
A packaging method and electroless plating technology, applied in liquid electroless plating, metal material coating process, semiconductor/solid-state device manufacturing, etc., can solve problems such as waste of resources in electroless plating process, avoid material waste, reduce production The effect of promoting reaction efficiency
Active Publication Date: 2022-07-19
SEMICON MFG ELECTRONICS (SHAOXING) CORP
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[0005] The purpose of the present invention is to provide a method for electroless plating of metals with different thicknesses, to solve the problem of waste of resources in the existing electroless plating process
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[0021] As described in the background art, a plurality of metal pads on the substrate are provided with different electrical lead-out methods according to their specific applications, and different electrical lead-out methods have different requirements on the parameters of the metal pads. For example, a portion of the metal pads will be wire-bonded for electrical extraction (eg, Au / Cu wire bond), while a portion of the metal pads will be used to mount solder bumps for pad extraction (eg, Clip metal). Generally speaking, when the bonding wire is used to realize the pad extraction, it requires the metal layer on the top layer of the metal pad to have a larger thickness (for example, the thickness of the gold layer on the top layer is required to be greater than 35nm) to meet the requirements of the wire bond. Timely requirements for metal properties to ensure the quality of bonding wires. However, when the pad is drawn out through solder bumps, there is no strict requirement on...
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Abstract
The invention provides a method for electroless plating of metals with different thicknesses and a method for encapsulating a device. Before electroless plating, part of the metal pads are electrically connected to the N-type doped region, so as to improve the reaction efficiency of the part of the metal pads when the substitution reaction occurs in the electroless plating process, so that the N-type doped regions can be connected in the same electroless plating process. A larger thickness of electroless metal plating can be formed on the metal pads in the doped area to meet the thickness requirements of the electroless metal plating, and at the same time, it avoids unnecessary data waste caused by the excessive thickness of the electroless metal plating on other metal pads, effectively reducing the Cost of production.
Description
technical field [0001] The invention relates to the technical field of semiconductors, in particular to a method for electroless plating of metals with different thicknesses and a method for packaging devices. Background technique [0002] Electroless plating is a new type of metal surface treatment technology, which is a process of metal deposition through a controllable redox reaction under the catalysis of metal. Compared with electroplating, electroless plating technology has the characteristics of uniform coating, flexible process, and no need for DC power equipment. In many fields, electroless plating technology has replaced electroplating technology and become an environmentally friendly surface treatment process. For example, in the current hot market automotive power devices, which pursue higher performance packaging requirements, for this reason, metal pads are usually formed by electroless plating. [0003] In semiconductor processing, a plurality of metal pads a...
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IPC IPC(8): C23C18/16C23C18/32C23C18/42H01L21/48
CPCC23C18/1651C23C18/42C23C18/32H01L21/4814
Inventor 眭小超
Owner SEMICON MFG ELECTRONICS (SHAOXING) CORP