Wafer bearing assembly and wafer interaction method

Abstract

The invention discloses a wafer bearing assembly and a wafer interaction method. The wafer bearing assembly comprises a fixed plate; the annular bracket is concentrically arranged on the peripheral side of the fixing plate; the reset assembly comprises a pneumatic seat and a supporting rod, and the pneumatic seat is connected to the fixing plate; one end of the supporting rod is slidably connected to the pneumatic seat, and the other end of the supporting rod is connected to the bracket; the cavity of the pneumatic seat is inflated and deflated, and the supporting rod can jack up or descend the bracket, so that the vertical position of the bracket is matched with the wafer interaction position.

Description

technical field [0001] The invention belongs to the technical field of chemical mechanical polishing, and in particular relates to a wafer carrying component and a wafer interaction method. Background technique [0002] The integrated circuit industry is the core of the information technology industry and plays a key role in promoting the transformation and upgrading of the manufacturing industry to digital and intelligent. A chip is the carrier of an integrated circuit, and chip manufacturing involves technological processes such as chip design, wafer manufacturing, wafer processing, electrical measurement, cutting, packaging, and testing. Among them, chemical mechanical polishing belongs to the wafer manufacturing process. [0003] Chemical Mechanical Polishing (CMP) is a globally planarized ultra-precision surface processing technology. In chemical mechanical polishing, the wafer is usually attracted to the bottom surface of the carrier head, and the side of the wafer w...

AI Technical Summary

Problems solved by technology

However, the spring or diaphragm is a passive elastic system. Although it is elastically deformed within the allowable displacement, it may be difficult to ensure continuous and accurate recovery with tens of thousands, hundreds of thousands or even millions of repeated compressions or stretches. To the initial state, there may be a risk of failure to take slices for manipulator interaction

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