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Wafer bearing assembly and wafer interaction method

A wafer carrying and component technology, applied in electrical components, semiconductor/solid-state device manufacturing, circuits, etc., can solve the problems of difficulty in ensuring continuous and accurate recovery to the initial state, failure to take wafers, etc., to improve wafer interaction efficiency, guarantee Accuracy and smooth effect

Pending Publication Date: 2022-05-13
HWATSING TECH
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  • Abstract
  • Description
  • Claims
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Problems solved by technology

However, the spring or diaphragm is a passive elastic system. Although it is elastically deformed within the allowable displacement, it may be difficult to ensure continuous and accurate recovery with tens of thousands, hundreds of thousands or even millions of repeated compressions or stretches. To the initial state, there may be a risk of failure to take slices for manipulator interaction

Method used

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  • Wafer bearing assembly and wafer interaction method
  • Wafer bearing assembly and wafer interaction method
  • Wafer bearing assembly and wafer interaction method

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Embodiment Construction

[0039] The technical solutions of the present invention will be described in detail below in conjunction with specific embodiments and accompanying drawings. The examples described here are specific implementations of the present invention and are used to illustrate the concept of the present invention; these descriptions are all explanatory and exemplary, and should not be construed as limiting the implementation of the present invention and the protection scope of the present invention . In addition to the embodiments described here, those skilled in the art can also adopt other obvious technical solutions based on the claims of the application and the contents disclosed in the specification, and these technical solutions include adopting any modifications made to the embodiments described here. Obvious alternatives and modified technical solutions.

[0040] The accompanying drawings in this specification are schematic diagrams, which assist in explaining the concept of the...

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Abstract

The invention discloses a wafer bearing assembly and a wafer interaction method. The wafer bearing assembly comprises a fixed plate; the annular bracket is concentrically arranged on the peripheral side of the fixing plate; the reset assembly comprises a pneumatic seat and a supporting rod, and the pneumatic seat is connected to the fixing plate; one end of the supporting rod is slidably connected to the pneumatic seat, and the other end of the supporting rod is connected to the bracket; the cavity of the pneumatic seat is inflated and deflated, and the supporting rod can jack up or descend the bracket, so that the vertical position of the bracket is matched with the wafer interaction position.

Description

technical field [0001] The invention belongs to the technical field of chemical mechanical polishing, and in particular relates to a wafer carrying component and a wafer interaction method. Background technique [0002] The integrated circuit industry is the core of the information technology industry and plays a key role in promoting the transformation and upgrading of the manufacturing industry to digital and intelligent. A chip is the carrier of an integrated circuit, and chip manufacturing involves technological processes such as chip design, wafer manufacturing, wafer processing, electrical measurement, cutting, packaging, and testing. Among them, chemical mechanical polishing belongs to the wafer manufacturing process. [0003] Chemical Mechanical Polishing (CMP) is a globally planarized ultra-precision surface processing technology. In chemical mechanical polishing, the wafer is usually attracted to the bottom surface of the carrier head, and the side of the wafer w...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/687H01L21/67H01L21/306
CPCH01L21/68792H01L21/68742H01L21/67253H01L21/30625
Inventor 吴兴王同庆
Owner HWATSING TECH
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