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Photocuring composition, binder and preparation method thereof, and bonding method of base material

A composition and light-curing technology, used in non-polymer organic compound adhesives, bonding methods, adhesives, etc., can solve the problems of short life of packaging materials, achieve short life, improve solubility, and avoid easy hydrolysis. Effect

Pending Publication Date: 2022-05-17
CHANGZHOU TRONLY ADVANCED ELECTRONICS MATERIALS CO LTD +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The main purpose of the present invention is to provide a photocurable composition, an adhesive and a preparation method thereof, and a bonding method for substrates, so as to solve the problem of short service life of packaging materials in the prior art

Method used

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  • Photocuring composition, binder and preparation method thereof, and bonding method of base material
  • Photocuring composition, binder and preparation method thereof, and bonding method of base material
  • Photocuring composition, binder and preparation method thereof, and bonding method of base material

Examples

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preparation example Construction

[0037] In yet another typical embodiment of the present application, a method for preparing the aforementioned adhesive is provided, which includes: Step S1, under ultraviolet light, the monomer in the aforementioned photocurable composition and The cationic photoinitiator is mixed to form a first mixed liquid; step S2, at a temperature of -10-20° C., the first mixed liquid, the photosensitive resin and the oligomer are mixed to form a binder.

[0038] Due to the high activity and easy curing of the tertiary epoxy monomer, the use of the ternary epoxy monomer and cationic photoinitiator is easy to partially cure in the early stage, resulting in the inability to carry out subsequent reactions with photosensitive resins and oligomers. In this application, the problem of dependence on light in the cationic polymerization process can be solved by using the four-membered epoxy monomer through the above two-step polymerization method. After photolysis of the cationic photoinitiator,...

Embodiment 8

[0052] The difference between Example 8 and Example 1 is that the parts by weight of components A / B / C / D are 1 / 0.1 / 1 / 1 in sequence, and finally a binder is obtained, which is left standing for use.

Embodiment 9

[0054] The difference between Example 9 and Example 1 is that the parts by weight of components A / B / C / D are 99 / 10 / 99 / 30 in sequence, and finally a binder is obtained, which is left standing for use.

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Abstract

The invention provides a photocuring composition, a binder, a preparation method of the binder and a bonding method of a base material. The photocuring composition comprises a monomer, a cationic photoinitiator, photosensitive resin and an oligomer, the monomer is an oxetane monomeric compound, the structural formula of the oxetane monomeric compound is shown in the specification, R1 is selected from any one of C1-C5 substituted or unsubstituted alkyl groups, R2 is selected from any one of C1-C5 substituted or unsubstituted alkyl groups, and R3 is selected from any one of C1-C5 substituted or unsubstituted alkyl groups. R2 is selected from any one of halogen, hydroxyl, C1-C40 substituted or non-substituted linear alkyl, C3-C40 substituted or non-substituted branched alkyl and C2-C40 substituted or non-substituted alkenyl, carbon or hydrogen in the linear alkyl, the branched alkyl and the alkenyl can be substituted or substituted by one or more ether bonds, carbon groups, phenyl, substituted phenyl or substituted, and the oligomer contains hydroxyl. According to the packaging material, gas escape caused by volatilization of the oxetane monomer in the curing process is avoided, and therefore the problem that the service life of the packaging material is short is solved.

Description

technical field [0001] The invention relates to the technical field of photocurable materials, in particular, to a photocurable composition, a binder and a preparation method thereof, and a substrate bonding method. Background technique [0002] In recent years, flat panel displays have been widely used and developed rapidly, especially liquid crystal displays, electroluminescent displays (EL), and the like. In the liquid crystal display, two glass substrates are usually hermetically bonded to each other with an adhesive, and liquid crystals are sealed therein. The adhesive used in the past is a heat-curable epoxy resin, but it must be heated and cured at a high temperature of 150-180°C for about 2 hours, and the production efficiency is low. As a new generation of flat-panel displays, EL displays have the advantages of high brightness, high efficiency, and high-speed response, especially the performance of organic EL elements is even better. However, the heat resistance o...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J4/06C09J4/02C09J5/00
CPCC09J4/06C09J5/00C09J2400/143C09J2467/006C09J2469/006C09J2400/163C09J4/00G02B5/30C08G65/18C08L63/00C09J163/00
Inventor 钱晓春张学龙马培培于培培
Owner CHANGZHOU TRONLY ADVANCED ELECTRONICS MATERIALS CO LTD