Vacuum side wafer state acquisition method for semiconductor vacuum transmission system
A vacuum transmission and semiconductor technology, applied in semiconductor/solid-state device manufacturing, conveyor objects, transportation and packaging, etc., can solve problems such as sensor installation and routing difficulties, economic losses, downtime, etc., to improve the overall intelligence level , easy to popularize and apply, and reduce economic losses
Pending Publication Date: 2022-05-27
上海广川科技有限公司
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Problems solved by technology
[0003] Since LoadLock needs to operate in a vacuum environment, it is very difficult to install and route sensors inside LoadLock
At present, the initialization of the LoadLock wafer state is judged by the host computer software storage or visual observation, and there will be many sudden shutdowns during the operation of the equipment, resulting in inconsistencies between the LoadLock wafer state stored in the software and the actual state. , in this case, if the operator neglects the status confirmation and correction due to negligence, it will lead to the issuance of wrong instructions, which will lead to failures such as crashes, resulting in unnecessary economic losses and downtime
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[0020] The specific embodiments of the present invention will be described in detail below with reference to the accompanying drawings and preferred embodiments.
[0021] In order to avoid the occurrence of objective factors such as wafer misalignment or wafer breakage when taking wafers, and improve the accuracy of wafer picking and placement, the semiconductor vacuum transfer system basically uses the AWC (Active Wafer Centering) function for detection and correction. A set of two sensors, referred to as AWC sensors, are placed in the direction of the station to be detected. For the deviation of the actual center and the teaching center during the transfer of the wafer by the robot, automatic correction is performed during the movement of the robot to ensure that the wafer are normally transported to the designated location. Therefore, these two AWC sensors are used as state detection sensors to check whether there is a wafer in the multi-layer card slot before the wafer is ...
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The invention relates to the technical field of semiconductor manufacturing, and discloses a vacuum side wafer state acquisition method for a semiconductor vacuum transmission system, a state detection sensor is arranged above the front side of a transmission gate valve of a vacuum transmission cavity and a LoadLock cavity, and before a vacuum robot takes and places a wafer from each layer of clamping groove of the LoadLock cavity, the state detection sensor detects the state of the wafer in the LoadLock cavity. When a wafer exists in the current layer of clamping groove, the state detection sensor is used for inquiring whether the wafer exists in the current layer of clamping groove or not, inquiring results are stored, and then the inquiring results are summarized and uploaded to the semiconductor vacuum transmission system to inform an operator to perform corresponding wafer supplementation. According to the obtaining method, only a state detection sensor needs to be additionally arranged, complex hardware is not needed, cost can be reduced to the maximum extent, and application and popularization are facilitated.
Description
technical field [0001] The present invention relates to the technical field of semiconductor manufacturing, in particular to a vacuum side wafer state acquisition method for a semiconductor vacuum transfer system. Background technique [0002] figure 1 It is a typical semiconductor vacuum transfer system, mainly consisting of 2-EFEM, 3-LoadLock, 4-vacuum transfer chamber and 5-process chamber, among which, 1-atmosphere robot is the core component of 2-EFEM, which is used to transfer wafers. It is transferred from the front-end atmospheric environment to 3-LoadLock. As a transit chamber between atmosphere and vacuum, LoadLock needs to be frequently switched between atmosphere and vacuum. LoadLock generally has one or more slots for wafer storage. . When picking and placing wafers from EFEM to LoadLock, it is necessary to fill the chamber with nitrogen to adjust the pressure in the chamber to atmospheric state, and then open the transfer valve near the EFEM side of LoadLock ...
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Patent Timeline
Login to View More IPC IPC(8): H01L21/677H01L21/67
CPCH01L21/67784H01L21/67265Y02P90/02
Inventor 董怀宝冯琳武一鸣
Owner 上海广川科技有限公司