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Optical module

A technology of optical modules and optical interfaces, which is applied in the field of optical modules, can solve problems such as chip performance degradation, failure, and module failure, and achieve efficient heat dissipation and reduce the effects of signal crosstalk

Active Publication Date: 2022-06-03
INNOLIGHT TECHNOLOGY (SUZHOU) LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Although highly integrated circuits are working towards miniaturization and low power consumption, with the development of high-speed and high-bandwidth module technology, the high thermal power consumption of the module has become a problem that must be faced. If a better heat dissipation effect cannot be guaranteed, The performance of the temperature-sensitive electro-optic / photoelectric conversion components and chips in the optical module will be greatly reduced, and even cause the entire module to fail to work or fail

Method used

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Embodiment Construction

[0074] The application will be described in detail below in conjunction with specific implementations shown in the accompanying drawings. However, these implementations do not limit the present application, and any structural, method, or functional changes made by those skilled in the art based on these implementations are included in the protection scope of the present application.

[0075] In each drawing of the present application, some dimensions of structures or parts are exaggerated relative to other structures or parts for convenience of illustration, and therefore, are only used to illustrate the basic structure of the subject matter of the present application.

[0076] In addition, terms used herein such as "upper", "above", "under", "below", etc. to express relative positions in space are for convenience of description to describe a unit or feature as shown in the drawings relative to A relationship to another cell or feature. The terms of spatial relative position ...

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Abstract

The invention discloses an optical module, which comprises a shell, a heat sink device which is arranged in the shell and is in heat conduction connection with the shell, a printed circuit board which is partially arranged on the heat sink device, and a first photoelectric chip and a second photoelectric chip which are arranged on the heat sink device, the first photoelectric chip and the second photoelectric chip are electrically connected with the printed circuit board, and the second photoelectric chip and the first photoelectric chip are separately arranged; the first photoelectric chip is located on the outer side of the printed circuit board, and the first photoelectric chip is electrically connected with the printed circuit board through a gold wire. The optical module has efficient heat dissipation capability, and reduces the signal crosstalk influence between the first photoelectric chip and the second photoelectric chip.

Description

[0001] This application is a divisional application of the Chinese invention patent application with the title of "optical module" and application number 201710590788X filed by the applicant on July 19, 2017. technical field [0002] The invention relates to the technical field of manufacturing optical communication components, in particular to an optical module. Background technique [0003] With the rapid development of 4G communication and the increasing demand for cloud computing, the market demand for high-speed optical modules is increasing day by day. In response to the market's demand for high-bandwidth and high-speed data transmission, module design is increasingly developing in the direction of miniaturization and high density. Although highly integrated circuits are working towards miniaturization and low power consumption, with the development of high-speed and high-bandwidth module technology, the high thermal power consumption of the module has become a problem...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G02B6/42
CPCG02B6/428G02B6/4268G02B6/4269
Inventor 陈龙孙雨舟于登群
Owner INNOLIGHT TECHNOLOGY (SUZHOU) LTD
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