optical module

Abstract

The present invention discloses an optical module. The optical module includes a housing, a heat sink device disposed in the housing and thermally connected to the housing, and a printed circuit board partially disposed on the heat sink device. Wherein, the optical module further includes a first optoelectronic chip and a second optoelectronic chip both disposed on the heat sink device, the first optoelectronic chip and the second optoelectronic chip are both electrically connected to the printed circuit board, The printed circuit board has a first surface, a second surface opposite to the first surface, and an opening penetrating from the first surface to the second surface, and the second photoelectric chip is arranged in the opening part, and the second optoelectronic chip is set separately from the first optoelectronic chip. The optical module has efficient heat dissipation capability, and reduces the signal crosstalk effect between the first optoelectronic chip and the second optoelectronic chip.

Description

technical field [0001] The invention relates to the technical field of manufacturing optical communication components, in particular to an optical module. Background technique [0002] With the rapid development of 4G communication and the increasing demand for cloud computing, the market demand for high-speed optical modules is increasing day by day. In response to the market's demand for high-bandwidth and high-speed data transmission, module design is increasingly developing in the direction of miniaturization and high density. Although highly integrated circuits are working towards miniaturization and low power consumption, with the development of high-speed and high-bandwidth module technology, the high thermal power consumption of the module has become a problem that must be faced. If a better heat dissipation effect cannot be guaranteed, Then the performance of the temperature-sensitive electro-optic / photoelectric conversion components and chips in the optical module...

AI Technical Summary

Problems solved by technology

Although highly integrated circuits are working towards miniaturization and low power consumption, with the development of high-speed and high-bandwidth module technology, the high thermal power consumption of the module has become a problem that must be faced. If a better heat dissipation effect cannot be guaranteed, The performance of the temperature-sensitive electro-optic / photoelectric conversion components and chips in the optical module will be greatly reduced, and even cause the entire module to fail to work or fail

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