Low-loss heat dissipation module

A heat dissipation module and low-loss technology, which is applied in substation/switch layout details, reactive power adjustment/elimination/compensation, electrical components, etc., can solve problems such as poor heat dissipation effect, large volume, and complicated internal structure layout, and achieve high performance Stability, volume minimization, and convenient construction and installation

Pending Publication Date: 2022-06-03
浙江维格泰电气科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The invention mainly solves the problems of complicated internal structure layout, bulky volume and poor heat dissipation effect of the existing high-power active reactive power compensation device; it provides a low-loss heat dissipation module

Method used

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  • Low-loss heat dissipation module
  • Low-loss heat dissipation module
  • Low-loss heat dissipation module

Examples

Experimental program
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Effect test

Embodiment

A low-loss heat dissipation module of this embodiment, such as figure 1As shown, it includes No. 1 supporting plate 1, No. 2 supporting plate 2, No. 3 supporting plate 3, box body 4, cover plate 5, front panel 6, rear panel 7, through-terminal 8, copper bar 9, fan fixing piece 10 , handle 11, fan mounting bracket 12, radiator 13, IGBT module 14, CT sampling interface 15, external communication interface 16, external control interface 17, DIP switch control port 18, through terminal interface 19, fan, indicator light 20 and The support plate fixing member 21, the cover plate 5, the front panel 6, the rear panel 7 and the box body 4 together form a closed container space. There are two heat dissipation hole areas on the front panel 6, the heat dissipation hole area at the bottom is the Q1 heat dissipation hole area, the heat dissipation hole area in the middle of the front panel 6 is the Q2 heat dissipation hole area; the rear panel 7 is provided with two heat dissipation hole ar...

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Abstract

The invention discloses a low-loss heat dissipation module. The problems that an existing high-power active reactive power compensation device is tedious in internal structure layout, large in size and poor in heat dissipation effect are solved. A box body, a front panel, a rear panel, a radiator, a cover plate, a first supporting plate, a second supporting plate, a third supporting plate, a fan and supporting plate fixing pieces are adopted, the box body, the front panel, the rear panel and the cover plate form a rectangular box, and the supporting plate fixing pieces are fixed to the inner wall of the box body; the first supporting plate, the second supporting plate and the third supporting plate are fixed in the box body through the supporting plate fixing pieces and are all parallel to the bottom of the box body, the fan and the radiator are installed at the bottom of the box body, and the flow guide plate is installed at an air outlet of the fan. The high-power modularized active SVG has the advantages that the size of the high-power modularized active SVG is minimized under the condition that heat dissipation is guaranteed through a functional layered design, and on-site construction and installation are facilitated.

Description

technical field [0001] The invention relates to the technical field of active reactive power compensation, in particular to a low-loss heat dissipation module. Background technique [0002] Active reactive power compensation refers to a device that uses a self-commutation bridge circuit composed of a fully-controlled high-power power electronic device IGBT to perform reactive power compensation. After the reactor is connected in parallel with the power grid, the phase and amplitude of the output voltage on the AC side of the bridge circuit are properly adjusted, or the current on the AC side is directly controlled, so that the circuit can absorb or emit reactive power that meets the requirements, and realize dynamic reactive power compensation. the goal of. At present, high-power active reactive power compensation devices have a large volume, and their internal structure design is complicated, functional circuits are messy, and they interfere with internal air ducts, result...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H02B1/56H02B1/46H02B1/48H02B1/20H02J3/18
CPCH02B1/565H02B1/46H02B1/48H02B1/20H02J3/18Y02E40/30
Inventor 孙新年张然陈武斌
Owner 浙江维格泰电气科技有限公司
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