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Electromagnetic pulse solid-state welding method for micro-interconnection welding spots of integrated circuit

A technology of solid-state welding and integrated circuits, which is applied to printed circuits, welding equipment, manufacturing tools, etc., can solve problems such as the inability to completely overcome the long-term service reliability of solder joints, and achieve long-term service reliability, simple equipment composition, and realization of The effect of a reliable connection

Pending Publication Date: 2022-06-07
CHONGQING UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Although the above methods can improve atomic migration to a certain extent, and inhibit the growth of IMC and the formation of voids and cracks, they still cannot completely overcome the long-term service reliability of solder joints. In view of this, this case arises after in-depth research on the above problems

Method used

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  • Electromagnetic pulse solid-state welding method for micro-interconnection welding spots of integrated circuit
  • Electromagnetic pulse solid-state welding method for micro-interconnection welding spots of integrated circuit
  • Electromagnetic pulse solid-state welding method for micro-interconnection welding spots of integrated circuit

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0042] Embodiment 1: The wire-to-wire double coil welding includes the following steps:

[0043] Step 1: According to the welding requirements, replace the backing plate of the welding equipment with a backing plate that conforms to the welding material. The backing plate is matched with a coil 9, and the number of coils 9 is two, which are placed on the upper and lower backing plates respectively. superior;

[0044] Step 2: Prepare the welding materials, place the welding materials on both sides of the equipment, select a pair of copper wires at a time, and insert them into standby from both sides of the equipment. The relative distance between the two copper wires is 0.5-2mm during standby;

[0045] Step 3: Insert the insulating film for welding from one side of the backing plate, isolate the welding material and the coil 9, and prevent the copper wire and the coil 9 from conducting electricity;

[0046] Step 4: Passing a large pulse current into the coil 9, so that the coi...

Embodiment 2

[0048]Example 2: Wire-to-wire single-coil welding, only in step S1 without arranging washers on the lower backing plate 6, using the lower backing plate 6 with only vertical slots 8, and welding a pair of copper wires in step S4 The upper part of the joint is used A coil 9.

Embodiment 3

[0049] Example 3: Wire-to-Board Welding An insulating spacer is provided between the copper wire and the pad.

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Abstract

The invention discloses a method for solid-state welding of micro-interconnection welding spots of an integrated circuit through electromagnetic pulses. The method comprises the steps of wire-to-wire double-coil welding, wire-to-wire single-coil welding and wire-to-plate welding. The method has the beneficial effects that three welding structures and methods based on the strong electromagnetic pulse principle are provided for wire-to-wire and wire-to-surface welding, so that reliable connection of the micro welding spots of the integrated circuit can be realized, and the long-term service reliability of the welding spots is improved; and moreover, the equipment is simple in composition, convenient to control and very simple in disassembly, replacement and later maintenance, and the cost-effectiveness ratio is greatly improved.

Description

technical field [0001] The invention relates to the technical field of integrated circuit processing, in particular to a method for electromagnetic pulse solid-state welding of integrated circuit micro-interconnection solder joints. Background technique [0002] At present, integrated circuits play a crucial role in cutting-edge technology fields such as 5G communications, smart cars, and the Internet of Things. The solder joint is the main interconnection structure of the integrated circuit, which is responsible for the transmission of electrical signals and provides mechanical support. Its long-term service reliability determines the performance and safety performance of electronic products and equipment. With the development of electronic devices towards miniaturization, thinness, high performance and multi-function, the diameter of solder joints has changed by orders of magnitude, and the minimum diameter is even less than 10μm. The reduction in the diameter of the sold...

Claims

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Application Information

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IPC IPC(8): B23K31/02B23K101/42
CPCB23K31/02B23K2101/42
Inventor 李成祥周言沈婷陈丹许晨楠戴明王现民
Owner CHONGQING UNIV
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