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Substrate for semiconductor device, method of manufacturing the same, semiconductor device thereof

A manufacturing method and semiconductor technology, applied in the direction of semiconductor devices, semiconductor/solid-state device components, electric solid-state devices, etc., can solve problems such as corrosion, wiring disconnection, etc.

Inactive Publication Date: 2004-04-14
KK TOSHIBA
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0014] In the through-hole 4, there is an unplated part regardless of hard gold plating or soft gold plating. If the copper or nickel base metal is exposed, battery action or corrosion will occur in the through-hole part 4, resulting in disconnection of the wiring.

Method used

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  • Substrate for semiconductor device, method of manufacturing the same, semiconductor device thereof
  • Substrate for semiconductor device, method of manufacturing the same, semiconductor device thereof
  • Substrate for semiconductor device, method of manufacturing the same, semiconductor device thereof

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Embodiment Construction

[0058] figure 1 Represents the semiconductor device substrate of the present invention. and, Image 6 A manufacturing process of the semiconductor device substrate of the present invention is shown.

[0059] First, the copper foil 24 with a thickness of 18 μm is pasted on both sides of the substrate 1 made of resin with an adhesive, Image 6 (a) shows the cross section of the substrate at this stage. Next, drill a hole on the substrate with a drill to form a through hole 4, Image 6 (b) shows the cross section of the substrate at this stage. After that, the entire substrate is plated with copper. The film thickness of the copper plating is, for example, 10 to 15 μm. Image 6 (c) shows the cross section of the substrate at this stage. As a result, the inside of the through hole 4 and the copper plating 25 on both surfaces of the substrate 1 electrically connect the two surfaces of the substrate. Then, proceed sequentially on the copper 25 of the substrate: pasting such...

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PUM

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Abstract

A semiconductor device is provided that includes a substrate (1) having a first side, a second side and a through-hole (4). An external connection terminal (3) is located on the first side of the substrate (1), and a chip connection terminal (2) is located on the second side of the substrate. The chip connection terminal (2) is electrically connected to the external connection terminal (3) via the through-hole (4). The external connection terminal (3), the inner portion of the through-hole (4) and a first portion of the chip connection terminal (2) have a hard gold plating, and a second portion of the chip connection terminal (2) has a soft gold plating.

Description

technical field [0001] The present invention relates to a substrate of a semiconductor device used, for example, in an IC card or the like, and a method of manufacturing the same, as well as a semiconductor device, a card module, and an information storage device. Background technique [0002] In recent years, card-type storage devices such as IC cards have been put into practical use. For such a card type memory device, the following semiconductor package can be used: a semiconductor chip-mounted molded resin with only one side, with planar type external connection terminals on its back side. Such a semiconductor chip is provided with, for example, a nonvolatile memory. [0003] Figure 9 and Figure 10 An example of such a semiconductor closure is shown. Figure 9 shows a cross-sectional view of a semiconductor package, Figure 10 (a) is a perspective view of a resin sealing surface of a semiconductor package. Figure 10 (b) is a perspective view of the external connec...

Claims

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Application Information

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IPC IPC(8): H01L23/13H01L23/31H01L23/498H05K3/24
CPCH05K3/244H01L23/3121H01L24/48H01L2924/01079H01L23/49805H01L23/498H01L2224/16H01L2224/48227H01L23/49855H01L24/49H01L23/13H01L2924/01078H01L2224/45144H01L2224/85444H01L2224/49175H01L2224/48644H01L2924/181H01L2224/16225H01L2924/00014H01L24/45H01L2924/00H01L2924/00012H01L2224/45015H01L2924/207
Inventor 福田昌利
Owner KK TOSHIBA