Copper foil carrier and manufacturing method thereof

Abstract

The invention provides a copper foil carrier and a manufacturing method thereof, and the method comprises the steps: respectively printing a first frame bonding layer and a second frame bonding layer on the edge areas of the two surfaces of a non-bonding lining layer, sequentially combining a first copper foil, the non-bonding lining layer and a second copper foil to form a combined body, and pressing the combined body under vacuum, high temperature and high pressure. The first copper foil and the non-bonding lining layer are tightly attached through the first frame bonding layer, the second copper foil and the non-bonding lining layer are tightly attached through the second frame bonding layer, the whole vacuum state is kept, the copper foil in the middle area in the bonding frame is tightly attached to the lining layer, and the copper foil carrier is manufactured. The inner layer material is prepared by impregnating the paper with the resin, so that the problem of powder falling during cutting of the PP material sheet is avoided, and abnormal pressing quality caused by powder falling of the PP material sheet is avoided; and meanwhile, the copper foil does not need to be processed, the conditions of poor pressing appearance pits and abnormal copper foil wrinkles caused by fine particle impurities are reduced, and the appearance flatness of the copper foil is ensured. Compared with a PP material sheet prepreg, the prepreg made of the paper impregnated resin is lower in cost and more convenient to operate.

Description

technical field [0001] The invention belongs to the technical field of copper foil carrier manufacturing technology, and particularly relates to a copper foil carrier and a manufacturing method thereof. Background technique [0002] In the production process of conventional PCB multi-layer boards, HDI boards (high-density interconnection boards) and ELIC boards (arbitrary-layer interconnection boards), the outer copper foil becomes thicker after the copper immersion electroplating process, due to the increase in the thickness of the copper layer. This process cannot make fine lines with line width L and line spacing S less than 30um; a method for semi-embedding lines after making fine lines on copper foil can make fine lines with line width and line spacing L / S<30um. To make fine lines with line width and line spacing L / S<30um, this method requires the use of a copper foil carrier. [0003] In the copper foil carrier produced by the prior art, the main body of the int...

AI Technical Summary

Problems solved by technology

[0003] For the copper foil carrier produced in the prior art, the main body of the middle lining layer is PP material, which is prone to powder drop when cutting to the required size and removing the middle part. Powder drop is easy to cause abnormal pressing quality, and the PP material The cost is high, and the cost of high-temperature-resistant release film is also high. At the same time, the alignment accuracy in the pressing process is high, and no slippage can occur after stacking, and the operation is cumbersome and demanding.

In addition, the operation of printing adhesive resin on copper foil will cause dust particle pollution on copper foil, and it is difficult to clean the copper foil thoroughly, which will easily cause a high defect rate of pressed apparent pits

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