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Superconducting quantum chip structure

A chip structure and superconducting quantum technology, applied in the field of quantum computing, can solve the problems of large size and difficult integration of superconducting quantum chips, and achieve the effect of reducing the plane size and improving the integration degree

Pending Publication Date: 2022-07-01
ORIGIN QUANTUM COMPUTING TECH (HEFEI) CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The superconducting quantum chip is equipped with qubits, reading cavity, microwave circuit, signal port, etc., and these components are integrated on the surface of a substrate, but with the improvement of the computing power requirements of quantum computers, the number of qubits is increasing. The size of superconducting quantum chips with two-dimensional structures prepared on one substrate will become larger and larger, making it difficult to integrate

Method used

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  • Superconducting quantum chip structure
  • Superconducting quantum chip structure
  • Superconducting quantum chip structure

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Experimental program
Comparison scheme
Effect test

Embodiment 1

[0034] like figure 2 As shown, this embodiment provides a superconducting quantum chip structure. Specifically, the quantum bit 101 and the reading cavity 102 are located on the first surface of the first structural member 10, and the first connection terminal 103 is located on the second surface of the first structural member 10 , the first structural member 10 is further provided with through holes 104 penetrating the first surface and the second surface of the first structural member 10 , the through holes 104 A first metal layer 105 is filled inside, and the first metal layer 105 is used to electrically connect the quantum bit 101 and the first connection terminal 103 .

[0035] Since the first structural member 10 and the second structural member 20 are double-sided structures and are arranged in parallel, and are supported and fixed by the support connecting member 30 , the first structural member 10 and the second structural member 20 are Both the first surface (ie th...

Embodiment 2

[0042] like Image 6 As shown, this embodiment provides a second superconducting quantum chip structure, the qubit 101 , the reading cavity 102 and the first connection terminal 103 are all located on the second surface of the first structural member 10 , the signal transmission line 201 and the second connection terminal 202 are located on the first surface of the second structural member 20 , wherein the second surface of the first structural member 10 and the first surface of the second structural member 20 A surface is arranged opposite.

[0043] Specifically, the superconducting quantum chip structure includes the first structural member 10 and the second structural member 20 arranged in parallel, and the quantum bit 101 and the reading cavity 102 are arranged on the first structural member 10 At the same time, the signal transmission line 201 is arranged on the first surface of the second structure member 20 to achieve a symmetrical arrangement, and the first structure ...

Embodiment 3

[0046] like Figure 7 As shown, this embodiment provides a third superconducting quantum chip structure, the qubit 101 , the reading cavity 102 and the first connection terminal 103 are all located on the second surface of the first structural member 10 , the second connection terminal 202 is located on the first surface of the second structural member 20 , the signal transmission line 201 is located on the second surface of the second structural member 20 , and the second structural member 20 is provided with a through The through holes 104 on the first surface and the second surface of the second structural member 20, the through holes 104 are filled with a first metal layer 105, and the first metal layer 105 is used to electrically connect the second connection terminal 202 and the signal transmission line 201 .

[0047] Compared with Embodiment 2, in this embodiment, the second connection terminal 202 of the second structural member 20 is disposed on the first surface, th...

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Abstract

The invention discloses a superconducting quantum chip structure, which comprises a first structural member, a second structural member and a support connecting member, wherein the first structural member is provided with a quantum bit, a reading cavity and a first connecting terminal, the quantum bit is in coupling connection with the reading cavity, and the quantum bit is electrically connected with the first connecting terminal; the second structural member is provided with a signal transmission line and a second connection terminal which are electrically connected. The two ends of the supporting connecting piece are electrically connected with the first connecting terminal and the second connecting terminal respectively, and the supporting connecting piece is used for transmitting the control signal received on the signal transmission line to the quantum bit. According to the invention, the plane size of the superconducting quantum chip structure is reduced, and the integration level of the multi-bit superconducting quantum chip is improved.

Description

technical field [0001] The invention belongs to the field of quantum computing, in particular to a superconducting quantum chip structure. Background technique [0002] A quantum computer is a kind of physical device that follows the laws of quantum mechanics to perform high-speed mathematical and logical operations, store and process quantum information. Quantum computers are mainly characterized by fast running speed, strong ability to handle information, and wide application range. The core of a quantum computer is a quantum processor, also known as a superconducting quantum chip. A classical integrated circuit chip constructs classical bits through transistors, and a binary information unit is a classical bit, while superconducting quantum chips use different physical systems to construct qubits, such as Superconducting quantum chips use Josephson junctions to realize two-level systems. In classical mechanical systems, the state of a bit is unique, while quantum mechani...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G06N10/20
CPCG06N10/00
Inventor 赵勇杰
Owner ORIGIN QUANTUM COMPUTING TECH (HEFEI) CO LTD