Wafer transfer system and method
A technology of wafer transmission system and transmission method, which is applied in the field of wafer transmission system, can solve the problems of low processing efficiency and restriction of wafer yield, achieve the effects of reducing the probability of dust pollution, ingenious and compact overall structure design, and improving position accuracy
Active Publication Date: 2022-07-01
江苏邑文微电子科技有限公司 +1
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Problems solved by technology
The transfer between individual process units will restrict the yield of wafers due to various influencing factors, such as dust pollution
Moreover, in the existing wafer transfer processing process, it is often necessary to complete the processing of the wafers in one cassette before processing the wafers in the next cassette, and the overall processing efficiency is not high.
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[0038] In order to make the purposes, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments These are some embodiments of the present invention, but not all embodiments. The components of the embodiments of the invention generally described and illustrated in the drawings herein may be arranged and designed in a variety of different configurations.
[0039] Thus, the following detailed description of the embodiments of the invention provided in the accompanying drawings are not intended to limit the scope of the invention as claimed, but are merely representative of selected embodiments of the invention. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary s...
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The embodiment of the invention provides a wafer transmission system and method, and relates to the technical field of semiconductors. The wafer transmission system comprises a front cavity, a transmission cavity, an exchange cavity and a rotary lifting device, a first exchange port and a second exchange port which are the same in shape are formed in a bottom plate of the transmission cavity, the first exchange port is in butt joint with a butt joint port in the front cavity, and the exchange cavity is in sealed connection with the front cavity and the transmission cavity through an opening. The rotary lifting device is mounted on the exchange cavity, the rotary lifting device comprises two sealing plates with exchangeable positions, the sealing plates are used for bearing the wafer box, and the two sealing plates can be respectively lifted into the first exchange port and the second exchange port to seal the first exchange port and the second exchange port; and the chip boxes carried by the chip boxes are respectively conveyed into the front cavity and the conveying cavity. The wafer transmission system can reduce the probability that the wafer is polluted by dust and improve the overall processing efficiency.
Description
technical field [0001] The present invention relates to the field of semiconductor technology, and in particular, to a wafer transfer system and method. Background technique [0002] In domestic semiconductor factories, there are a large number of types of equipment used for chip manufacturing. These various types of equipment will be used successively, repeatedly or cyclically due to different processes. The transfer between individual process units can limit wafer yield due to various influencing factors, such as dust contamination. Moreover, in the existing wafer transfer process, it is often necessary to process the wafers in one cassette before processing the wafers in the next cassette, and the overall processing efficiency is not high. SUMMARY OF THE INVENTION [0003] The objects of the present invention include providing a wafer transfer system and method, which can reduce the probability of wafers being polluted by dust and improve the overall processing effici...
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IPC IPC(8): H01L21/677H05K5/06
CPCH01L21/67763H01L21/67766H01L21/67775H01L21/67778H05K5/06Y02P70/50
Inventor 孙文彬石宇
Owner 江苏邑文微电子科技有限公司