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LED packaging structure and display panel

A technology of LED packaging and LED chips, which is applied in the direction of semiconductor devices, electrical components, circuits, etc., can solve the problems of high blue light content, low luminous efficiency, and low power, and achieve the effect of improving luminous efficiency and reducing blue light components

Pending Publication Date: 2022-07-05
TCL CHINA STAR OPTOELECTRONICS TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The embodiment of the present application provides an LED packaging structure and a display panel, which can solve the problems of low luminous efficiency, high blue light content, and low power of current quantum dot LEDs.

Method used

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  • LED packaging structure and display panel
  • LED packaging structure and display panel

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0029] see figure 1 , figure 1 This is a first three-dimensional structural schematic diagram of an LED package structure 100 provided in an embodiment of the present application.

[0030] The embodiment of the present application provides an LED package structure 100 , and the LED package structure 100 includes a housing 10 , a quantum dot layer 20 , a bracket 30 , and an LED chip 40 . The housing 10 includes a bottom plate 11 and a side wall 12 arranged on the bottom plate 11, the bottom plate 11 and the side wall 12 form a groove 13; the quantum dot layer 20 is arranged on the bottom plate 11 in the groove 13; the bracket 30 is arranged above the groove 13 ; The LED chip 40 is arranged on the side surface of the bracket 30 facing the groove 13 , and the light-emitting direction of the LED chip 40 faces the quantum dot layer 20 .

[0031] Specifically, the housing 10 includes a bottom plate 11 and a side wall 12 disposed on the bottom plate 11 . The bottom plate 11 and the...

Embodiment 2

[0042] This embodiment is the same as or similar to the above-mentioned embodiment, and the difference lies in that the features of the LED package structure are further described.

[0043] see figure 2 and image 3 , figure 2 A schematic diagram of a second three-dimensional structure of an LED packaging structure 100 provided in an embodiment of the present application; image 3This is an exploded view or an exploded schematic view of a second three-dimensional structure of an LED package structure 100 provided in an embodiment of the present application. figure 2 and figure 1 The difference is figure 2 The middle LED package structure further includes a lens 50 .

[0044] In some embodiments, the LED package structure 100 further includes a lens 50 , the lens 50 is disposed on a side of the bracket 30 away from the groove 13 , and the lens 50 is connected to the side wall 12 .

[0045] Specifically, the lens 50 is arranged on the side of the bracket 30 away from t...

Embodiment 3

[0059] This embodiment is the same as or similar to the above-mentioned embodiment, and the difference lies in that the features of the LED package structure are further described.

[0060] In some embodiments, the bracket 30 includes an arc-shaped first end portion 31 and a second end portion 32, and a middle portion 33 connected between the first end portion 31 and the second end portion 32, and the middle portion 33 is Flat, the LED chip 40 is disposed on the middle portion 33 .

[0061] Specifically, in order to facilitate the arrangement of the LED chips, the middle portion 33 of the bracket 30 is set as a plane, and the LED chips are arranged on the surface of the middle portion 33 facing the quantum dot layer 20 .

[0062] Specifically, the first end portion 31 and the second end portion 32 are both arc-shaped, which can facilitate setting the bracket 30 on the housing 10 and make the LED chip and the quantum dot layer 20 farther away.

[0063] In some embodiments, the...

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Abstract

The invention discloses an LED packaging structure and a display panel, and the LED packaging structure comprises a housing which comprises a bottom plate and a side wall disposed on the bottom plate, and the bottom plate and the side wall form a groove; the quantum dot layer is arranged on the bottom plate in the groove; the bracket is arranged above the groove; the LED chip is arranged on the surface of the side, facing the groove, of the support, and the light emitting direction of the LED chip faces the quantum dot layer. The LED chip is inversely arranged above the groove, the quantum dot layer is arranged in the groove, the LED chip is far away from the quantum dot layer, the light emitted by the LED chip is converted by the quantum dot layer, then is reflected by the bottom plate and is emitted from one side, far away from the quantum dot layer, of the LED chip, and the light of the LED chip passes through the quantum dot layer twice, so that the phenomenon of fluorescence quenching is avoided, and the service life of the LED chip is prolonged. The light emitting efficiency of the LED packaging structure can be improved, and the blue light component in the emergent light of the LED packaging structure is reduced.

Description

technical field [0001] The present application relates to the field of display, and in particular, to an LED packaging structure and a display panel. Background technique [0002] The quantum dot TV has been widely praised since its launch. Due to the many excellent properties of quantum dot materials, the new LCD display panel combining LCD (liquid crystal display panel) and quantum dot backlight source has a wide color gamut and high color saturation. , The excellent display effect of color purity, its color and display quality are close to or even exceed the trend of OLED displays (organic light-emitting display panels). combined) have been extensively studied. [0003] However, the current preparation of quantum dot LEDs only uses quantum dot materials instead of traditional phosphors to fill the interior of the lamp beads, but this method still requires more quantum dot materials, and due to the limitation of filling technology, it is easy to form quantum dots locally ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L33/50H01L33/60H01L33/64H01L25/075
CPCH01L33/507H01L33/60H01L25/0753H01L33/641H01L33/642
Inventor 向昌明
Owner TCL CHINA STAR OPTOELECTRONICS TECH CO LTD
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