Method for laser processing printed substrate and apparatus for laser processing printed substrate

Abstract

A laser processing method for a printed circuit board and a laser processing machine for a printed circuit board, the laser processing method for a printed circuit board being a laser processing method for processing a workpiece by irradiating the workpiece with laser light output by a laser light output device controlled by a high-frequency pulse wave output, and a time t0 determination unit that determines a time t0 from activation of the high-frequency pulse wave output to actual output of the laser light in advance, and that is provided with a mechanism for changing a traveling direction of the laser light in a traveling path of the laser light, and that irradiates all of the laser light to the workpiece while the high-frequency pulse wave output is activated. At least a part of the laser light is separated from the workpiece while the high-frequency pulse wave output is closed, so that the wiring length of the printed circuit board can be shortened, and high-quality and high-efficiency trepanning can be performed.

Description

technical field [0001] The invention relates to a processing method for a printed substrate and a processing machine for the printed substrate, in particular to a laser processing method for the printed substrate and a laser processing machine for the printed substrate. The hole (non-through hole, hereinafter referred to as hole or BH) connects the copper layer on the surface and the copper layer on the lower layer, or is processed on the front and back of the two-sided substrate to form a through hole (through hole, hereinafter referred to as a through hole or a through hole). TH) to connect the copper layer on the front and the copper layer on the back. Background technique [0002] The modular printed circuit board is composed of a copper layer of a conductor and an insulating layer (hereinafter simply referred to as an "insulating layer") formed of a resin containing glass fibers or fillers. [0003] The copper layer will not only use a layer with a thickness of 5 to 12...

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Problems solved by technology

[0019] According to the technology of the above-mentioned patent document 1, the copper layer thickness of the surface treated surface can be 7 μm, and the thickness of the insulating layer is 60 μm printed substrate, or the copper layer thickness of the surface without surface treatment is 1.5 μm, and Printed substrates with an insulating layer thickness of 40 μm are processed, but there is no clear information about the diameter width of holes that can be processed.

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