Polyimide film, copper sheet laminate, and circuit board

A polyimide layer, polyimide film technology, applied in the direction of circuit substrate materials, printed circuits, printed circuits, etc., can solve the problem of large dimensional change rate of polyimide film, insufficient dielectric properties, linear expansion Large coefficient and other problems, to achieve excellent dimensional stability, low hygroscopicity and dielectric tangent, and achieve the effect of low hygroscopicity

Pending Publication Date: 2022-07-08
NIPPON STEEL CHEM &MATERIAL CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, regarding the polyimide film formed of the above-mentioned polyimide, although the dielectric constant at 10 GHz is 3.2 or less, the dielectric tangent exceeds 0.01, and the dielectric properties are not yet sufficient.
In addition, polyimides using such aliphatic monomers have problems such as large linear expansion coefficients, large dimensional change rates of polyimide films, and decreased flame retardancy.

Method used

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  • Polyimide film, copper sheet laminate, and circuit board
  • Polyimide film, copper sheet laminate, and circuit board
  • Polyimide film, copper sheet laminate, and circuit board

Examples

Experimental program
Comparison scheme
Effect test

Embodiment

[0214] An Example is shown below, and the characteristic of this invention is demonstrated more concretely. However, the scope of the present invention is not limited to the Examples. In addition, in the following examples, unless otherwise specified, various measurements and evaluations were performed by the following ones.

[0215] [Measurement of Viscosity]

[0216] The viscosity at 25°C was measured using an E-type viscometer (manufactured by Brookfield, trade name: DV-II+Pro). The rotational speed was set so that the torque would be 10% to 90%, and the value when the viscosity was stabilized was read after 2 minutes elapsed after the measurement was started.

[0217] [Measurement of glass transition temperature (Tg)]

[0218] Regarding the glass transition temperature, using a dynamic viscoelasticity measuring apparatus (DMA: UBM Co., Ltd., trade name: E4000F), from 30° C. to 400° C. at a temperature increase rate of 4° C. / min and a frequency of 11 Hz, 5 mm×20 mm The ...

Synthetic example A-1

[0259] Under a nitrogen stream, 1.335 g of m-TB (0.0063 mol), 10.414 g of TPE-R (0.0356 mol), and DMAc in such an amount that the solid content concentration after polymerization was 12% by weight were put into a 300-ml separable flask. Stir and dissolve at room temperature. Next, after adding 0.932 g of PMDA (0.0043 mol) and 11.319 g of BPDA (0.0385 mol), stirring was continued at room temperature for 3 hours to perform a polymerization reaction to obtain a polyamic acid solution A-1. The solution viscosity of the polyamic acid solution A-1 was 1,420 cps.

[0260] Next, after the polyamic acid solution A-1 was uniformly applied to one side (surface roughness Rz: 2.1 μm) of an electrolytic copper foil having a thickness of 12 μm so that the thickness after hardening would be about 25 μm, it was heated at 120° C. drying under heat and solvent removal. Furthermore, a stepwise heat treatment is performed from 120° C. to 360° C. within 30 minutes to complete imidization. About ...

Synthetic example A-2

[0262] Under a nitrogen stream, 0.451 g of m-TB (0.0021 mol), 11.794 g of TPE-R (0.0403 mol), and DMAc in an amount such that the solid content concentration after polymerization was 12 wt % were put into a 300-ml separable flask. Stir and dissolve at room temperature. Next, after adding 2.834 g of PMDA (0.0130 mol) and 8.921 g of BPDA (0.0303 mol), the polymerization reaction was continued at room temperature for 3 hours while stirring to obtain a polyamic acid solution A-2. The solution viscosity of the polyamic acid solution A-2 was 1,510 cps.

[0263] Next, after the polyamic acid solution A-2 was uniformly applied to one side (surface roughness Rz: 2.1 μm) of an electrolytic copper foil having a thickness of 12 μm so that the thickness after hardening would be about 25 μm, it was heated at 120° C. drying under heat and solvent removal. Furthermore, a stepwise heat treatment is performed from 120° C. to 360° C. within 30 minutes to complete imidization. About the obtain...

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Abstract

A polyimide film having a non-thermoplastic polyimide layer, a copper sheet laminate, and a circuit board, the non-thermoplastic polyimide constituting the non-thermoplastic polyimide layer preferably comprising a total of 80 parts by mole or more of BPDA residues derived from 3, 3 ', 4, 4'-biphenyltetracarboxylic acid dianhydride (BPDA) and 1, 3 ', 4, 4'-biphenyltetracarboxylic acid dianhydride (BPDA) with respect to 100 parts by mole of tetracarboxylic acid residues, and a total of 1, 3 ', 4, 4'-biphenyltetracarboxylic acid dianhydride (BPDA) derived from 1, 3 ', 4, 4'-biphenyltetracarboxylic acid dianhydride (BPDA). The present invention pertains to a polyamide resin composition which is characterized by preferably having a dielectric tangent (Df) of 0.004 or less and preferably having at least one of TAHQ residues derived from 1, 2, 4-phenylene bis (trimellitic acid monoester) dianhydride (TAHQ) and at least one of PMDA residues derived from pyromellitic dianhydride (PMDA) and NTCDA residues derived from 2, 3, 6, 7-naphthalene tetracarboxylic acid dianhydride (NTDA), and preferably having a dielectric tangent (Df) of 0.004 or less. By forming the non-thermoplastic polyimide layer using a specific acid anhydride as a raw material, both the physical properties of the matrix resin layer and the low moisture absorption rate can be ensured, and the low dielectric tangent can be achieved.

Description

[0001] The present invention is a divisional application of the invention patent application with the application number 201780059180.2 and the invention name "polyimide film, copper sheet laminate and circuit substrate" filed on September 11, 2017. [0002] CROSS-REFERENCE TO RELATED APPLICATIONS [0003] This application claims based on Japanese Patent Application No. 2016-191786 filed on September 29, 2016, Japanese Patent Application No. 2016-191787 filed on September 29, 2016, and Japanese Patent Application filed on December 28, 2016 Priority is granted to Japanese Patent Application No. 2016-256927 filed on December 28, 2016 and Japanese Patent Application No. 2016-256928, the entire contents of which are incorporated herein by reference. technical field [0004] The invention relates to a polyimide film, a copper sheet laminate and a circuit substrate. Background technique [0005] In recent years, with the progress of miniaturization, weight reduction, and space sa...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08J5/18C08L79/08C08G73/10B32B27/28B32B15/20B32B15/08H05K1/03H05K3/02
CPCC08J5/18C08G73/10B32B27/281B32B15/20B32B15/08H05K1/0346H05K1/0393H05K3/022B32B2307/206B32B2307/734B32B2457/00C08J2379/08B32B27/34H05K2201/0133H05K2201/0154C09D179/08B32B7/02B32B7/12B32B27/08B32B27/06B32B2250/40B32B27/36B32B27/20B32B2270/00B32B2307/538B32B2307/30B32B2307/54B32B2307/732B32B2307/204B32B2457/08
Inventor 安藤智典西山哲平须藤芳树森亮
Owner NIPPON STEEL CHEM &MATERIAL CO LTD
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