LED backlight assembly and manufacturing method thereof

A technology for a backlight assembly and a manufacturing method, applied in the field of LED backlight assembly and its manufacturing, can solve the problems of uneven light mixing, disadvantage, and cost reduction, and achieve the effect of ensuring uniformity

Pending Publication Date: 2022-07-08
罗化芯显示科技开发(江苏)有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

However, in practical applications, especially the POB structure, its OD value is often small, and the light mixing is uneven, resulting in poor light output from the backlight assembly.
The existing technology often solves this problem by adding a reflective layer on the sealing film, but because the reflective layer is metal, its bonding force with the sealing film layer is not good, and the manufacturing process is cumbersome, which is not conducive to reducing costs

Method used

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  • LED backlight assembly and manufacturing method thereof
  • LED backlight assembly and manufacturing method thereof
  • LED backlight assembly and manufacturing method thereof

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Embodiment Construction

[0032] In order to make the purpose, technical solutions and advantages of the embodiments of the present disclosure more clear, the technical solutions of the embodiments of the present disclosure will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present disclosure.

[0033] The LED backlight assembly of the present invention aims to provide an LED backlight assembly with simple manufacturing process and good light mixing effect. see Figure 1-2 , the LED backlight assembly of the present invention includes a printed circuit board 10 and a plurality of LED chips 12 on a circuit layer 11 on the printed circuit board. The printed circuit board 10 has a rectangular structure, and has a circuit layer 11 on its upper surface. The circuit layer 11 at least includes a driving circuit, an electrical connection circuit, and the like.

[0034] The plurality of LED chips 12 are electrically connected to the circuit laye...

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Abstract

The invention provides an LED backlight assembly and a manufacturing method thereof, and relates to the field of LED display illumination. The LED backlight assembly includes: a printed circuit board including a circuit layer on an upper surface thereof; the plurality of LED chips are fixed on the printed circuit board and are electrically connected to the circuit layer; the organic layer is arranged on the upper surface of the printed circuit board and seals the plurality of LED chips; wherein the organic layer comprises a light-activatable organic matter, the lower surface of the organic layer is provided with criss-cross first reflecting layers formed by irradiating the light-activatable organic matter through laser, the first reflecting layers define a plurality of grids, and the plurality of LED chips are respectively located in the plurality of grids; and the first reflecting layer is provided with a plurality of gaps for the circuit layer to pass through. According to the LED backlight assembly, sufficient light mixing of the adjacent LED chips is achieved, and the uniformity of emergent light is guaranteed.

Description

technical field [0001] The present invention relates to the field of light-emitting diode display lighting, in particular to an LED backlight assembly and a manufacturing method thereof. Background technique [0002] The backlight source is often a surface light source formed by a backlight assembly. Its structure includes POB (package on board) and COB (chip on board). It combines LED chips (packaged chips or bare chips) on the circuit board. After pressing a sealing film layer to achieve sealing, the final backlight module structure is obtained. However, in practical applications, especially the POB structure, the OD value is often small and the light mixing is not uniform, resulting in poor light output effect of the backlight assembly. In the prior art, a reflective layer is often added on the sealing film to solve this problem, but since the reflective layer is metal, the bonding force between the reflective layer and the sealing film layer is poor, and the manufacturi...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): F21K9/65F21V9/30G02F1/13357F21Y105/14F21Y115/10
CPCF21K9/65F21V9/30G02F1/133603G02F1/133605G02F1/133614F21Y2105/14F21Y2115/10
Inventor 陈文娟瞿澄李雍周良军
Owner 罗化芯显示科技开发(江苏)有限公司
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